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Standard Thick Film Chip Resistors - Vishay

Document Number: 20035 For technical questions, contact: 04-Jun-12125D/CRCW e3 VishayStandard Thick film chip ResistorsTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Stability R/R = 1 % for 1000 h at 70 C 2 mm pitch packaging option for 0603 size Pure tin solder contacts on Ni barrier layerprovides compatibility with lead (Pb)-free and leadcontaining soldering processes Metal glaze on high quality ceramic AEC-Q200 qualified Material categorization: For definitions of complianceplease see Notes These Resistors do not feature a limited lifetime when operated within the permissible limits.

Marking: See data sheet “Surface Mount Resistor Marking” ... Vishay Standard Thick Film Chip Resistors THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

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Transcription of Standard Thick Film Chip Resistors - Vishay

1 Document Number: 20035 For technical questions, contact: 04-Jun-12125D/CRCW e3 VishayStandard Thick film chip ResistorsTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Stability R/R = 1 % for 1000 h at 70 C 2 mm pitch packaging option for 0603 size Pure tin solder contacts on Ni barrier layerprovides compatibility with lead (Pb)-free and leadcontaining soldering processes Metal glaze on high quality ceramic AEC-Q200 qualified Material categorization: For definitions of complianceplease see Notes These Resistors do not feature a limited lifetime when operated within the permissible limits.

2 However, resistance value drift increasing overoperating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Marking: See data sheet Surface Mount resistor Marking (document number 20020). Power rating depends on the max. temperature at the solder point, the component placement density and the substrate ELECTRICAL SPECIFICATIONSMODELSIZERATED DISSIPATIONP70 CWLIMITINGELEMENTVO LTAG EUmax. AC/DCTEMPERATURECOEFFICIENTppm/KTOLERANC E%RESISTANCERANGE SERIESINCHMETRICD10/CRCW04020402 RR 100 200 1 51R0 to 10ME24; E96E24 Zero-Ohm- resistor : Rmax. = 20 m , Imax. at 70 C = AD11/CRCW06030603 RR 100 200 1 51R0 to 10ME24; E96E24 Zero-Ohm- resistor : Rmax.

3 = 20 m , Imax. at 70 C = AD12/CRCW08050805 RR 100 200 1 51R0 to 10ME24; E96E24 Zero-Ohm- resistor : Rmax. = 20 m , Imax. at 70 C = AD25/CRCW12061206 RR 100 200 1 51R0 to 10ME24; E96E24 Zero-Ohm- resistor : Rmax. = 20 m , Imax. at 70 C = ACRCW12101210 RR 100 200 1 51R0 to 10ME24; E96E24 Zero-Ohm- resistor : Rmax. = 20 m , Imax. at 70 C = ACRCW12181218 RR 100 200 1 51R0 to 2M2E24; E96E24 Zero-Ohm- resistor : Rmax. = 20 m , Imax. at 70 C = ACRCW20102010 RR 100 200 1 51R0 to 10ME24; E96E24 Zero-Ohm- resistor : Rmax. = 20 m , Imax. at 70 C = ACRCW25122512 RR 100 200 1 51R0 to 10ME24; E96E24 Zero-Ohm- resistor : Rmax. = 20 m , Imax. at 70 C = A technical questions, contact: Number: 20035126 Revision: 04-Jun-12D/CRCW e3 VishayStandard Thick film chip ResistorsTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

4 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT (1)The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of theprinted-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 C is not SPECIFICATIONSPARAMETERUNITD10/CRCW0402D 11/CRCW0603D12/CRCW0805D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 Rated dissipation P70 (1) element voltage Umax. AC/DCV5075150200200200400500 Insulation voltage Uins (1 min)V> 75> 100> 200> 300> 300> 300> 300> 300 Insulation resistance > 109 Category temperature range C- 55 to + 155 Failure rateh-1< x 10- NUMBER AND PRODUCT DESCRIPTIONPart Number: CRCW0603562 RFKECMODELVALUETOLERANCETCRPACKAGINGSPEC IALCRCW0402 CRCW0603 CRCW0805 CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512R = DecimalK = ThousandM = Million0000 = JumperF = %J = %Z = JumperK = 100 ppm/KN = 200 ppm/K0 = JumperEA, EB, EC, ED,EE, EF, EG, EH,EI, EL,EKUp to 2 digitsProduct Description.

5 D11/CRCW0603 100 562R 1 % ET6 e3D11/CRCW0603100562R1 %ET6e3 MODELTCRRESISTANCE VALUETOLERANCEPA C K A G I N GLEAD (Pb)-FREED10/CRCW0402D11/CRCW0603D12/CRC W0805D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 200 ppm/K 100 ppm/K10R = 10 562R = 562 10K = 10 k 1M0 = 1 M 0R0 = Jumper 5 % 1 %ET1, ET2,ET3, ET4,ET5, ET6, ET7, ET8, ET9, EF4, E02, E67,E82e3 = Pure tintermination finishCRCW0603562 RFKEC Document Number: 20035 For technical questions, contact: 04-Jun-12127D/CRCW e3 Standard Thick film chip ResistorsVishayTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT TAPEWIDTHPITCHREEL DIAMETERCRCW0402ED = ET710 000 Paper tape IEC 60068-3 Type I8 mm2 mm180 mm/7"EE = EF450 000330 mm/13"CRCW0603EI = ET250008 mm2 mm180 mm/7"ED = ET310 000180 mm/7"EL = ET420 000285 "EE = ET850 000330 mm/13"EA = ET150008 mm4 mm180 mm/7"EB = ET510 000285 "EC = ET620 000330 mm/13"CRCW0805EA = ET150008 mm4 mm180 mm/7"EB = ET510 000285 "EC = ET620 000330 mm/13"CRCW1206EA = ET150008 mm4 mm180 mm/7"EB = ET510 000285 "EC = ET620 000330 mm/13"CRCW1210EA = ET150008 mm4 mm180 mm/7"EB = ET510 000285 "EC = ET620 000330 mm/13"CRCW1218EK = ET94000 Blister tape IEC 60068-3 Type II12 mm4 mm180 mm/7"CRCW2010EF = E02400012 mm4 mm180 mm/7"CRCW2512EG = E67200012 mm 8 mm 180

6 Mm/7"EH = E8240004 mmSIZEDIMENSIONS in millimetersSOLDER PAD DIMENSIONS in millimetersREFLOW SOLDERINGWAVE SOLDERINGINCH + + + + + technical questions, contact: Number: 20035128 Revision: 04-Jun-12D/CRCW e3 VishayStandard Thick film chip ResistorsTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT PulsePulse Load max. (W)P2512121820101210120608050603040210-6 Pulse Duration i (s)t10-510-410-310-210-1110100 Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and max.

7 ;for permissible resistance change equivalent to 8000 h Continuous PulseMaximum pulse load, continuous pulses; applicable if P P ( amb) and max.;for permissible resistance change equivalent to 8000 h operationPulse Duration i (s)Continuous Pulse Load max. (W)tP10010-510-410-310-210-1110100251212 182010121012060805060304022000200010- 610- 510- 410- 310- 210- 1 110 Maximum pulse voltage, single and continuous pulses; applicable ifP Pmax.; for permissible resistance change equivalent to 8000 h operationPulse Duration i (s)40060080010001200140016001800 Pulse Voltage max. (V)251220101206/1210/1218080506030402t Document Number: 20035 For technical questions, contact: 04-Jun-12129D/CRCW e3 Standard Thick film chip ResistorsVishayTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

8 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT 500501001500 DeratingAmbient Temperature ambFraction of Rated Dissipation P705010070 C% 10120 Resistance Value R in Attenuation of 3rd Harmonic A3 in dB1008040602001001K10K100K1M10M1206, 20100805060304021001K10K100K1M10M100 10 Noise A1 in V/V20101206080506030402 Resistance Value R in technical questions, contact: Number: 20035130 Revision: 04-Jun-12D/CRCW e3 VishayStandard Thick film chip ResistorsTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT PROCEDURES AND REQUIREMENTSEN 60115-1 CLAUSEIEC 60068-2 TEST METHODTESTPROCEDUREREQUIREMENTSPERMISSIB LE CHANGE ( R)SIZE 0402 to 2512 STABILITY CLASS 1OR BETTERSTABILITY CLASS 2 OR BETTERS tability for product types:D/CRCW e31 to 10 M 1 % 5 % proofU = x Uins; 60 sNo flashover or time overloadU= x 2 x Umax.

9 ;duration: Acc. to style % R + ) % R + ) (Td)SolderabilitySolder bath method;Sn60Pb40non activated flux;(235 5) C(2 ) sGood tinning ( 95 % covered)no visible damageSolder bath method; flux;(245 5) C(3 ) sGood tinning ( 95 % covered)no visible coefficient(20/- 55/20) C and (20/125/20) C 100 ppm/K 200 (Uu3)Shear (adhesion)RR 1608 and smaller: 9 NRR 2012 and larger: 45 NNo visible (Uu1)Substrate bendingDepth 2 mm;3 timesNo visible damage, no open circuit in bent position ( % R + ) (Na)Rapid change of temperature30 min. at - 55 C;30 min. at 125 C5 cycles ( % R + ) ( % R + )1000 cycles (1 % R + ) (1 % R + ) sequence:- (1 % R + ) (2 % R + ) (Ba)Dry heat125 C; 16 h (Db)Damp heat, cyclic55 C; 90 % RH; 24 h; 1 (Aa)Cold- 55 C; 2 (M)Low air pressure1 kPa; (25 10) C; 1 (Db)Damp heat, cyclic55 C; 90 % RH; 24 h; 5 loadU= at 70 CU= Umax.

10 ; h on; h off;70 C; 1000 h (1 % R + ) (2 % R + )70 C; 8000 h (2 % R + ) (4 % R + )P70 x RP70 x RP70 x R Document Number: 20035 For technical questions, contact: 04-Jun-12131D/CRCW e3 Standard Thick film chip ResistorsVishayTHIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 140400, sectional specification EN 140401-802, detail specification IEC 60068-2-x, environmental test proceduresPackaging of components is done in paper or blister tapes according to IEC (Td)Resistance to soldering heatSolder bath method(260 5) C;(10 1) s ( % R + ) ( % R + ) ,needle flame testIEC 60695-11-5;10 sNo burning after 30 (Cab)Damp heat, steady state(40 2) C;(93 3) % RH.


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