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Surface Examination, Unclad and Metal-Clad

The Institute for Interconnecting and Packaging Electronic Circuits Number 2215 Sanders Road Northbrook, IL 60062-6135 Subject Surface Examination, Unclad and Metal-Clad Material Date Revision 12/82 A. IPC-TM-650. Originating Task Group TEST METHODS MANUAL N/A. Scope This test method identifies the major areas of Scratches Scratches can be measured with the use of concern during a visual examination and describes the recom- a microscope (30X maximum). mended procedures. Wrinkles Wrinkles should be viewed by normal or cor- Application Documents None. rected 20/20 vision. Test Specimen Any representative clad or Unclad Inclusions Inclusions should be measured using 18X. sample of printed wiring material. to 30X magnification. Equipment/Apparatus Magnifier or microscope Notes capable of up to 30X magnification, having a reticle capable of For additional reference see: measuring to the nearest in. IPC-CF-150: Copper Foil IPC-A-600: Acceptability of Printed Boards Procedures MIL-P-13949: Laminate Materials Pinholes Pinholes are predetermined by visual exami- nation using not less than 10X magnification on the specimen.

1.0 Scope This test method identifies the major areas of concernduringavisualexaminationanddescribestherecom-mendedprocedures. 2.0 ApplicationDocuments None. 3.0 Test Specimen Any representative clad or unclad

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Transcription of Surface Examination, Unclad and Metal-Clad

1 The Institute for Interconnecting and Packaging Electronic Circuits Number 2215 Sanders Road Northbrook, IL 60062-6135 Subject Surface Examination, Unclad and Metal-Clad Material Date Revision 12/82 A. IPC-TM-650. Originating Task Group TEST METHODS MANUAL N/A. Scope This test method identifies the major areas of Scratches Scratches can be measured with the use of concern during a visual examination and describes the recom- a microscope (30X maximum). mended procedures. Wrinkles Wrinkles should be viewed by normal or cor- Application Documents None. rected 20/20 vision. Test Specimen Any representative clad or Unclad Inclusions Inclusions should be measured using 18X. sample of printed wiring material. to 30X magnification. Equipment/Apparatus Magnifier or microscope Notes capable of up to 30X magnification, having a reticle capable of For additional reference see: measuring to the nearest in. IPC-CF-150: Copper Foil IPC-A-600: Acceptability of Printed Boards Procedures MIL-P-13949: Laminate Materials Pinholes Pinholes are predetermined by visual exami- nation using not less than 10X magnification on the specimen.

2 Copper surfaces should be prepared by cleaning or light etch- ing. Pits and Dents The maximum total point count for pits and dents, per square foot of panel inspected is determined as follows: Longest Dimension (inch) .. Point Value to 1. 0. 011 to inclusive .. 2. to 4. to 7. over .. 30. Pits and dents should be determined visually using not less than 10X magnification on the specimen. Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this Page 1 of 1. material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.


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