Example: bankruptcy

Surface Mount Power Resistor Thick Film Technology

D2TO35. vishay Sfernice Surface Mount Power Resistor Thick Film Technology FEATURES. AEC-Q200 qualified 35 W at 25 C case temperature Surface mounted Resistor - TO-263 (D2 PAK). style package Wide resistance range from to 550 k . Non inductive Resistor isolated from metal tab DESIGN SUPPORT TOOLS click logo to get started Solder reflow secure at 270 C/10 s Material categorization: for definitions of compliance Models please see Available DIMENSIONS in millimeters Footprint recommendation for solderable contact area: min. 5. 2. Tolerance: mm Notes For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C.

D2TO35 www.vishay.com Vishay Sfernice Revision: 29-Mar-16 2 Document Number: 51058 For technical questions, contact: sferfixedresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

Tags:

  Vishay

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Transcription of Surface Mount Power Resistor Thick Film Technology

1 D2TO35. vishay Sfernice Surface Mount Power Resistor Thick Film Technology FEATURES. AEC-Q200 qualified 35 W at 25 C case temperature Surface mounted Resistor - TO-263 (D2 PAK). style package Wide resistance range from to 550 k . Non inductive Resistor isolated from metal tab DESIGN SUPPORT TOOLS click logo to get started Solder reflow secure at 270 C/10 s Material categorization: for definitions of compliance Models please see Available DIMENSIONS in millimeters Footprint recommendation for solderable contact area: min. 5. 2. Tolerance: mm Notes For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C.

2 Power dissipation is W at an ambient temperature of 25 C when mounted on a double sided copper board using FR4 HTG, 70 m of copper, 39 mm x 30 mm x mm, with thermal vias STANDARD ELECTRICAL SPECIFICATIONS. RESISTANCE RATED Power LIMITING ELEMENT TEMPERATURE CRITICAL. TOLERANCE. MODEL SIZE RANGE P25 C VOLTAGE UL COEFFICIENT RESISTANCE. %. W V ppm/ C . D2TO35 TO-263 to 550K 35 500 1, 2, 5, 10 150, 250, 700, 1100 MECHANICAL SPECIFICATIONS TECHNICAL SPECIFICATIONS. Mechanical Protection Molded Power Rating and 35 W at 25 C (case Resistive Element Thick film Thermal Resistance temperature). of the Component RTH (j - c): C/W. Substrate Alumina Temperature Coefficient See Special Feature table Connections Tinned copper Standard 150 ppm/ C.

3 Weight g max. Dielectric Strength 2000 VRMS - 1 min - 10 mA max. IEC 60115-1 (between terminals and board). ENVIRONMENTAL SPECIFICATIONS Insulation Resistance 106 M . Temperature Range -55 C to +175 C Inductance H. IEC 60695-11-5. Flammability 2 applications 30 s DIMENSIONS. separated by 60 s TO-263 style Standard Package (D2 PAK). Revision: 29-Mar-16 1 Document Number: 51058. For technical questions, contact: THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT. ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT D2TO35. vishay Sfernice SPECIAL FEATURES. Resistance Values Tolerances 1 % at 10 %.

4 Requirement Temperature Coefficient (TCR) . (-55 C +150 C) 1100 ppm/ C 700 ppm/ C 250 ppm/ C 150 ppm/ C. IEC 60115-1. PERFORMANCE. TESTS CONDITIONS REQUIREMENTS. IEC 60115-1 Momentary Overload Pr 5 s for R < 2 ( % + ). Pr 5 s for R 2 . US < UL. IEC 60115-1. Load Life (1 % + ). 1000 h, 90/30 Pr at +25 C. AEC-Q200 REV D conditions: High Temperature Exposure MIL-STD-202 method 108 ( % + ). 1000 h, +175 C, unpowered Pre-conditioning 3 reflows according JESTD020D. Temperature Cycling IEC 60068-2-14 test Na ( % + ). 1000 cycles, -55 C, +175 C. Dwell time - 15 min AEC-Q200 REV D conditions: Moisture Resistance MIL-STD-202 method 106 ( % + ).

5 10 cycles, 24 h, unpowered AEC-Q200 REV D conditions: Biased Humidity MIL-STD-202 method 103 (1 % + ). 1000 h, 85 C, 85% RH. AEC-Q200 REV D conditions: Pre-conditioning 3 reflows according Operational Life JESTD020D (1 % + ). MIL-STD-202 method 108. 2000 h, 90/30, powered, +125 C. AEC-Q200 REV D conditions: ESD Human Body Model AEC-Q200-002 ( % + ). 25 kVAD. AEC-Q200 REV D conditions: MIL-STD-202 method 204. Vibration ( % + ). 5 g's for 20 min, 12 cycles test from 10 Hz to 2000 Hz AEC-Q200 REV D conditions: MIL-STD-202 method 213. Mechanical Shock ( % + ). 100 g's, 6 ms, m/s 3 shocks/direction AEC-Q200 REV D conditions: Board Flex AEC-Q200-005 ( % + ).

6 Bending 2 mm, 60 s AEC-Q200 REV D conditions: Terminal Strength AEC-Q200-006 ( % + ). kgf, 60 s ASSEMBLY SPECIFICATIONS. For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C. TESTS CONDITIONS REQUIREMENTS. IEC 60115-1. Resistance to Soldering Heat IEC 60068-2-58 ( % + ). Solder bath method: 270 C/10 s Level: 1. IPC/JEDEC J-STD-020C. Moisture Sensitivity Level (MSL) + pass requirements of TCR. 85 C/85 % RH/168 h overload and dielectric strength after MSL. Revision: 29-Mar-16 2 Document Number: 51058. For technical questions, contact: THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT.

7 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT D2TO35. vishay Sfernice CHOICE OF THE BOARD. The user must choose the board according to the working conditions of the component ( Power , room temperature). Maximum working temperature must not exceed 175 C. The dissipated Power is simply calculated by the following ratio: T 1 . P = ---------------------------------------- ---------------------------------------- ----------- R TH (j - c) + R TH (c - h) + R TH (h - a). P: Expressed in W. T: Difference between maximum working temperature and room temperature or fluid cooling temperature RTH (j - c): Thermal resistance value measured between resistive layer and outer side of the Resistor .

8 It is the thermal resistance of the component: C/W. RTH (c - h): Thermal resistance value measured between outer side of the Resistor and upper side of the board. This is the thermal resistance of the solder layer. RTH (h - a): Thermal resistance of the board. Example: RTH (c - h) + RTH (h - a) for D2TO35 Power rating W at ambient temperature +25 C.. Thermal resistance RTH (j - c): C/W . Considering equation (1) we have: . T = 175 C - 25 C = 150 C . RTH (j - c) + RTH (c - h) + RTH (h - a) = T/P = 150 = C/W . RTH (c - h) + RTH (h - a) = C/W - C/W = C/W. Single Pulse: These informations are for a single pulse on a cold Resistor at 25 C (not already used for a dissipation) and for pulses of 100 ms maximum duration.

9 The formula used to calculate E is: 2. U- x t E = P x t = ------- R. with: E (J): Pulse energy P (W): Pulse Power t (s): Pulse duration U (V): Pulse voltage R (W): Resistor The energy calculated must be less: than that allowed by the graph. Revision: 29-Mar-16 3 Document Number: 51058. For technical questions, contact: THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT. ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT D2TO35. vishay Sfernice OVERLOADS Power RATING. In any case the applied voltage must be lower than the The temperature of the case should be maintained within the maximum overload voltage of 750 V.

10 The values indicated limits specified. on the graph below are applicable to resistors in air or 120. mounted onto a board. ENERGY CURVE 100. RATED Power IN %. 100. 75. 10. ENERGY IN JOULES. 50. 1. 25. 0. 0 20 40 60 80 100 120 140 160 175. CASE TEMPERATURE IN C. 10-7 10-6 10-5 10-4 10-3 10-2 10-1. OVERLOAD DURATION IN s PACKAGING. Reel Power CURVE Tube 100 000 Tape dimensions (mm) for reel: 16. 10 000. Power IN W. 24. 11. 1000. MARKING. 100 Model, style, resistance value (in ), tolerance (in %), 10-7 10-6 10-5 10-4 10-3 10-2 10-1 manufacturing date, vishay Sfernice trademark OVERLOAD DURATION IN s Revision: 29-Mar-16 4 Document Number: 51058.


Related search queries