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Technical Data Sheet ABLEBOND 8175 - Bonding …

TechnicalDataSheet ABLEBOND 8175 May-2011 PRODUCTDESCRIPTIONABLEBOND 8175provides thefollowingproductcharacteristics:Techn ologyEpoxyAppearanceSilverCureHeatcurePr oduct Benefits Electricallyconductive Thermallyconductive Stressabsorbing Pb-freealternativeto solder StencilorscreenprintableApplicationDieat tachABLEBOND 8175isdesignedforsolderreplacementinmicr oelectronicinterconnectapplications. Thisadhesivemaybeusedwiththickfilmmetall izationsortraditionalprintedcircuitboard surfaces. Itiscapableofresolvingfinepitchresolutio n( inch) whenprintedusingeithera stainlesssteelmeshscreenora 8175meetstherequirementsofMIL-STD-883, ( rpm) ,BrookfieldCP51, 25 C, mPa s(cP):Speed5 rpm55,000 WorkLife@25 C, weeks2 ShelfLife@-40 C, year1 FlashPoint- SeeMSDSTYPICALCURINGPERFORMANCECureSched ule30 minutes@150 C AlternativeCureSchedule60 minutes@150 C(forbondlines<1 milthick) AlternativeCureSchedule260 minutes@130 C (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment,ov enloadingandactualoventemperatures.

Technical Data Sheet ABLEBOND 8175 May-2011 PRODUCT DESCRIPTION ABLEBOND 8175 provides the following product characteristics: Technology Epoxy Appearance Silver

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Transcription of Technical Data Sheet ABLEBOND 8175 - Bonding …

1 TechnicalDataSheet ABLEBOND 8175 May-2011 PRODUCTDESCRIPTIONABLEBOND 8175provides thefollowingproductcharacteristics:Techn ologyEpoxyAppearanceSilverCureHeatcurePr oduct Benefits Electricallyconductive Thermallyconductive Stressabsorbing Pb-freealternativeto solder StencilorscreenprintableApplicationDieat tachABLEBOND 8175isdesignedforsolderreplacementinmicr oelectronicinterconnectapplications. Thisadhesivemaybeusedwiththickfilmmetall izationsortraditionalprintedcircuitboard surfaces. Itiscapableofresolvingfinepitchresolutio n( inch) whenprintedusingeithera stainlesssteelmeshscreenora 8175meetstherequirementsofMIL-STD-883, ( rpm) ,BrookfieldCP51, 25 C, mPa s(cP):Speed5 rpm55,000 WorkLife@25 C, weeks2 ShelfLife@-40 C, year1 FlashPoint- SeeMSDSTYPICALCURINGPERFORMANCECureSched ule30 minutes@150 C AlternativeCureSchedule60 minutes@150 C(forbondlines<1 milthick) AlternativeCureSchedule260 minutes@130 C (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment,ov enloadingandactualoventemperatures.

2 TYPICALPROPERTIESOFCUREDMATERIALP hysicalProperties:Coefficientof ThermalExpansionppm/ C:BelowTg55 AboveTg200 GlassTransitionTemperature, C90 ThermalConductivity@121 C, @300 C,% @-50 to150 C,psi5,000 ElectricalProperties:VolumeResistivity, :Cuto Agmetallization@25 C,psi6,200 Lap ShearStrength:Alto Al@25 C,psi1,650 GENERALINFORMATIONF orsafehandlinginformationonthisproduct,c onsulttheMaterialSafetyDataSheet,(MSDS). containerto , C, stainlesssteelmeshscreenora oneof therecommendedcureschedules. drylocation. : -40 CMaterialremovedfromcontainersmaybeconta minatedduringuse. Donotreturnproducttotheoriginalcontainer . additionalinformationis required,pleasecontactyourlocalTechnical ServiceCenterorCustomerServiceRepresenta tive. Conversions( Cx )+ 32= FkV/mmx V/milmm/ inchesN x lbN/mmx lb/inN/mm x 145= psiMPax 145= psiN m x lb inN mx lb ftN mm oz inmPa s= istheuser'sresponsibilitytodeterminesuit abilityfortheuser' ,HenkelCorporationanditsaffiliates( Henkel )specificallydisclaimsallwarrantiesexpre ssedorimplied,includingwarrantiesofmerch antabilityorfitnessfora particularpurpose, , ,usingthisdataasa Henkelin + + +


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