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Technical Data Sheet LOCTITE 3612 - chiptronics.com.my

TechnicalDataSheet LOCTITE3612 January-2014 PRODUCTDESCRIPTIONLOCTITE3612providesthe followingproductcharacteristics:Technolo gyEpoxyChemicalTypeEpoxyAppearance(uncur ed)Yellow viscousliquidLMSF luorescencePositive underUVlightComponentsOne component - requiresnomixingCureHeatcureApplicationS urfacemountadhesiveKeySubstratesSMDcompo nentsto PCBO therApplicationAreasSmallpartsbondingDis penseMethodStencilprintWetStrengthVeryhi ghLOCTITE3612 forapplicationswheremediumprintspeeds,hi ghdotprofile, @ 25 ,25 C,PaCone& PlateRheometer:HaakePK100,M10/PK1 2 Cone350 to725 LMSC assonViscosity @25 C,Pa sCone& PlateRheometer:HaakePK100,M10/PK1 2 Cone15 to55 FlashPoint- SeeSDSTYPICALCURINGPERFORMANCER ecommendedconditionsforcuringareexposure toheatabove100 C(typically90-120seconds@150 C).

The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of …

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Transcription of Technical Data Sheet LOCTITE 3612 - chiptronics.com.my

1 TechnicalDataSheet LOCTITE3612 January-2014 PRODUCTDESCRIPTIONLOCTITE3612providesthe followingproductcharacteristics:Technolo gyEpoxyChemicalTypeEpoxyAppearance(uncur ed)Yellow viscousliquidLMSF luorescencePositive underUVlightComponentsOne component - requiresnomixingCureHeatcureApplicationS urfacemountadhesiveKeySubstratesSMDcompo nentsto PCBO therApplicationAreasSmallpartsbondingDis penseMethodStencilprintWetStrengthVeryhi ghLOCTITE3612 forapplicationswheremediumprintspeeds,hi ghdotprofile, @ 25 ,25 C,PaCone& PlateRheometer:HaakePK100,M10/PK1 2 Cone350 to725 LMSC assonViscosity @25 C,Pa sCone& PlateRheometer:HaakePK100,M10/PK1 2 Cone15 to55 FlashPoint- SeeSDSTYPICALCURINGPERFORMANCER ecommendedconditionsforcuringareexposure toheatabove100 C(typically90-120seconds@150 C).

2 , practice, measuredon1206capacitors @22 C,testedaccordingto IPCSM817, % of Full StrengthTime at Temperature, minutes1007550250012345678910150 C125 C100 CIsothermalDSCC onversion5 minutes@ 125 C,%95 to100 LMSTYPICALPROPERTIESOFCUREDMATERIALC uredfor 30 minutes @150 CPhysicalProperties:Coefficientof ThermalExpansion, ISO11359-2, K-152 10-6 Coefficientof ThermalConductivity, ISO8302,W/(m K) ,kJ/(kg K) , BS5350-B1@25 C,g/cm , ASTMD 4065, C155 Electrical Properties:DielectricConstant/ DissipationFactor,IEC60250 , , ,IEC60093, 1015 SurfaceResistivity,IEC60093, 22 1015 DielectricBreakdownStrength,IEC60243-1, , :TestBoard:IPC-B-25A, combpatternD:Initial10 109 Agedfor7 days@85 C,85%RH10 109 ElectrolyticCorrosion,DIN53489A - 1 TDSLOCTITE3612, January-2014 TYPICALPERFORMANCEOFCUREDMATERIALA dhesivePropertiesCuredfor 5 minutes @125 CTorqueStrength,IPCSM817, :C-1206onbareFR4board N mm 30 to70 ( ) (4 to10)Pull-offStrength,SiemensnormSN59651 .

3 C-1206onbareFR4board N 32 to64 (lb) ( )Push-offStrength:C-1206onbareFR4board N 30 LMS (lb) ( )Curedfor 30 minutes @150 CLapShearStrength,ISO4587:Steel (gritblasted) N/mm 15 LMS (psi) ( 2,175)Bondstrengthachievedinpracticewill varyconsiderablydepending on theSMDcomponenttype,adhesivedotsizeandth etype, RESISTANCEC uredfor 30 minutes @150 CLapShearStrength,ISO4587:Steel (gritblasted)HotStrengthTestedat temperature% Initial Strength @ 22 CTemperature, C1007550250-50050100150200250 Chemical/SolventResistanceAgedundercondi tionsindicatedandtested @22 C.

4 %ofinitialstrengthEnvironment C100h500h1000hAir221009590 Heat/humidity98%RH40858585 ResistancetoHotSolderDipCuredfor 90 seconds @150 CHotSolderDip,IPCSM817,TM-650 ,Pass/Fail:R-1206onbareFR4board:Supporte d60secondsabovesolderbath@260 Canddippedfor10seconds PassResistancetoWaveSolderProcessCuredfo r 90 seconds @150 CWaveSolder,IPCSM817@260 C:R-1206onbareFR4board:Rampupconditions: 4 C/sSoldertimeonturbulentandlaminarwave:1 5- 20seconds PassGENERALINFORMATIONF orsafehandlinginformationonthisproduct,c onsulttheSafetyDataSheet(SDS).

5 ,suchasProFlow ,PumpPrint , Varidot . LoctitestencilprintChipbondersaresuitabl eforprintspeedsof20mm/supto150mm/s- refrigeratortheadhesive mustbeallowedtoequilibrateto roomtemperaturebeforeuse,typically2 to4 C,andRHlessthan70%foroptimumresults. Highertemperatureswilldecreasetheviscosi tyandwilleffecttheprintingresults. Higherhumidityconditionsmayleadtomoistur epickupandwillreducethe"onstencil"lifeof theproduct: At25 C,55%RH,theproductwillremaindispensableo nthestencilfora maximumof5 daysofcontinuousoperation. Thequalityoftheprintresultswilldependonb oardsupport,printgap,printspeed, (steelstencil/steelsqueegee/singlestroke mode*):PrintSpeed60mm/sSqueegeePressure3 to4 N/cm (justenoughtocleanthestencil) to3 mm/sGapbetweenStencilandPCBO ncontact*ForhigherdotsPrintandFloodModec anbeused.

6 Setuppressureforfrontsqueegeeasdescribed above. Forfloodprinting,rearsqueegeepressuresho uldbesetto0 kgtoleaveasufficientadhesivelayer(1 to2mm)onthestencil. ,MEKoresterblendssuchasLOCTITE 7360 . Alcohols( )cancuretheadhesiveandmayleadtoblockedap erturesif leftonthestencilforover5 minutes. Automaticunder-stencil-wipeis December-13, 2001. Testreportsforeachbatchareavailableforth eindicatedproperties. LMStestreportsincludeselectedQCtestparam etersconsideredappropriatetospecificatio nsforcustomeruse. Additionally,comprehensivecontrolsarein placetoassureproductqualityandconsistenc y.

7 Specialcustomerspecificationrequirements maybecoordinatedthroughHenkel + + + , January-2014 StorageStoreproductintheunopenedcontaine rina drylocation. : 2 Cto8 C. Storagebelow2 Corgreaterthan8 Ccanadverselyaffectproductproperties. Materialremovedfromcontainersmaybecontam inatedduringuse. Donotreturnproducttotheoriginalcontainer . , ( Cx )+ 32= FkV/mmx V/milmm/ inches m/ milN x lbN/mmx lb/inN/mm x 145= psiMPax 145= psiN m x lb inN mx lb ftN mm oz inmPa s= cPNote:TheinformationprovidedinthisTechn icalDataSheet(TDS) ,therefore,notliableforthesuitabilityofo urproductfortheproductionprocessesandcon ditionsinrespectofwhichyouusethem, confirmsuchsuitabilityof respectoftheinformationin theTechnicalDataSheetoranyotherwrittenor oralrecommendation(s)regardingtheconcern edproductis excluded,exceptif ,HenkelElectronicMaterialsNV,HenkelNeder landBV,HenkelTechnologiesFranceSASandHen kelFranceSApleaseadditionallynotethefoll owing.

8 IncaseHenkelwouldbeneverthelessheldliabl e,onwhateverlegalground,Henkel sliabilitywillin noeventexceedtheamountof , applicable:TheinformationprovidedinthisT echnicalDataSheet(TDS) ,therefore,notliableforthesuitabilityofo urproductfortheproductionprocessesandcon ditionsinrespectofwhichyouusethem, confirmsuchsuitabilityof respectoftheinformationin theTechnicalDataSheetoranyotherwrittenor oralrecommendation(s)regardingtheconcern edproductis excluded,exceptif ,ResinTechnologyGroup,Inc.,orHenkelCanad aCorporation, 'sresponsibilitytodeterminesuitabilityfo rtheuser'spurposeofanyproductionmethodsm entionedhereinandtoadoptsuchprecautionsa smaybeadvisablefortheprotectionofpropert yandof personsagainstanyhazardsthatmaybeinvolve din ,HenkelCorporationspecificallydisclaimsa llwarrantiesexpressedorimplied,including warrantiesofmerchantabilityorfitnessfora particularpurpose,arisingfromsaleoruseof HenkelCorporation , ,usingthisdataasa ,alltrademarksinthisdocumentare trademarksof denotesatrademarkregisteredin + + +


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