Technical Information - Optiprint

1 Technical Information E96683. Copyright by Optiprint AG. 9442 Berneck Schweiz Tel: +41 (0)71 747 86 86. Fax: +41 (0)71 747 86 87. Rev. Dezember 2012. Changes because of Technical advantages and new market requirements reserved. Table of contents 1. INTRODUCTION .. 5. 2. MANUFACTURING CAPABILITIES .. 5. SINGLE AND DOUBLE SIDED PCBS .. 5. PLATED THROUGH-HOLE PCBS .. 5. MULTILAYER .. 5. Base materials .. 5. Example of a typical 4-layer rigid construction .. 5. FLEX PCBS .. 6. Base materials .. 6. RIGID-FLEX PCB .. 6. Example of a typical 4-layer flex-rigid construction .. 6. VIA PCB .. 6. MICROWAVE PCB .. 7. Softboards .. 7. Multilayer .. 7. Mixed Material 7. Hard Backed Boards .. 8. Metal Core Boards .. 8. SPECIAL PCB'S .. 8. 3. DESIGN FOR MANUFACTURING .. 9. PCB THICKNESS .. 9. HOLE DIAMETER .. 9. 9. Conductor width and annular ring .. 9. Electro-Plating, plated-through holes, via holes, Via .. 11.

2 Conductor width and spacing Via .. 13. ETCHING TOLERANCE .. 14. Definition .. 14. Tolerances .. 14. SOLDER RESIST .. 15. SCREENED 15. PANELIZATION .. 15. Standard panelization and usable areas .. 15. 16. Profile tolerances .. 16. Hole to hole tolerance .. 16. Hole to track pattern tolerance .. 16. Routing .. 16. Laser cutting .. 16. Scoring (V-Cut) .. 17. Sawing .. 17. Punching .. 17. BOW & TWIST .. 18. CARBON RESISTORS AND SILVER CONDUCTIVE PASTE .. 19. Created: ht Approved: so page 3 of 36. 4. SURFACE FINISHES .. 21. OVERVIEW .. 21. ELECTROLESS NICKEL / GOLD (ENIG) .. 22. Product description .. 22. Suitable for .. 22. Application .. 22. Thickness .. 22. Characteristics .. 22. ELECTROLESS PALLADIUM (PD) ENEPIG .. 23. Application .. 23. Characteristics Pd .. 23. Thickness .. 23. LEAD FREE HOT AIR LEVELING .. 23. HARD GOLD, 23. BONDGOLD, GALVANIC .. 24. BONDGOLD, IMMERSION (ENIGEG) .. 24. IMMERSION TIN (SN).

3 24. ORGANIC SURFACE PROTECTION (ENTEK) .. 24. ELECTROLESS SILVER (AG) .. 24. AUTOCATALYTIC SILVER IMMERSION GOLD (ASIG) .. 24. 5. SOLDER- AND BONDABILITY .. 25. STORAGE CONDITIONS .. 25. GENERAL CONDITIONS .. 25. SHELF 25. 6. BARE BOARD TESTING .. 26. ELECTRICAL TEST .. 26. Flying Probe Test .. 26. OPTICAL INSPECTION .. 26. 7. DATA TRANSFER .. 27. 27. DRILL FILES .. 27. 27. DATA SUBMISSION .. 27. 8. REQUIREMENTS FOR UL APPROVAL (FILE E 96 683, 94 V-0) .. 28. LOGO .. 28. GENERAL .. 28. 9. MATERIAL COMPARISON CHART .. 29. OTHERS .. 34. FLEXIBLE MATERIAL .. 35. THERMAL CONDUCTIVE MATERIAL .. 36. Created: ht Approved: so page 4 of 36. 1. Introduction We specialize in custom-built solutions and cover a very wide range. This Technical Information can only present a small extract and cannot be complete. We recommend you to contact us to work out the best possible solution to your particular requirements with our experts.

4 We will also be pleased to answer any questions that might arise. 2. Manufacturing capabilities Single and double sided PCBs With all common materials from thickness to 6mm, up to a width of 610mm and a length of 8m (further special formats upon request). Plated through-hole PCBs With all common materials from thickness mm, up to a width of 610mm and a length of (further special formats upon request). Multilayer Multilayer up to 16 layers (higher on request). Base materials As standard, base material FR4 is used. Apart from that, there are many materials available to fulfill your various requirements. : low moisture absorption, high temperature stability, low thermal expansion etc. Example of a typical 4-layer rigid construction Material Layer Type Thickness in mm Cu-Foil Layer 1 Prepreg Prepreg 2116 Prepreg Prepreg 7628 Copper Layer 2 Inner layer FR4-Core Copper Layer 3 Prepreg Prepreg 7628 Prepreg Prepreg 2116 Cu-Foil Layer 4 Calculated thickness without copper plating Created: ht Approved: so page 5 of 36.

5 Flex PCBs We produce single, double-sided and multilayer flexible PCB's for static and dynamic applications. Base materials For low bending strain applications, a thin epoxy material (FR4) can be used. For cost efficient solutions a PET or PEN material can be the choice. Dynamic applications and tight radii require special, product specific flexible materials. Serving as surface protection is either a flexible solder resist or for particularly high bending strain, a polyimide cover foil (Coverlay). FR4 or polyimide stiffeners can be applied in selected areas. Rigid-Flex PCB. Multilayer with flexible layers to connect 2 or more rigid PCB's. Build-ups are symmetrical or asymmetrical according to the requirements of the application. Example of a typical 4-layer flex-rigid construction Material Layer Type Thickness mm Copper Layer 1 Outer layer FR4 core Copper Layer 2 Adhesive FR 0200 Coverlay FR 0110 Copper Layer 3 Outer layer Kapton FR9121 flexible Copper Layer 4 Coverlay FR 0110 Calculated total thickness without copper plating Via PCB.

6 From thin laminates, Prepreg or RCC. Applications range from double-sided boards to sequential multi-layers. Created: ht Approved: so page 6 of 36. Microwave PCB. Production of highest precision for boards with a frequency of up to 100 GHz. PTFE. material is mainly used with various dielectric properties. Impedance r available from to Softboards Single-, double-sided, as well as plated-through PCB's, produced with material with tightly defined dielectric properties. The most suitable material is chosen depending on customer requirements and specifications. Multilayer Multi-layered PCB's using high frequency materials. Please note, not every HF-material is suitable for multilayer application. Please contact us in the design phase. Various Prepregs, bonding films and adhesives are available. Mixed Material Multilayer Multilayers with differing materials ( PTFE and FR4). Symmetrical and asymmetrical build-ups are possible.

7 Please contact us early in the design phase so that together an ideal solution can be found. Created: ht Approved: so page 7 of 36. Hard Backed Boards PCB's with metal backing (Copper, Brass, Aluminium, Invar,..). Many different build-up variations are possible Metal Core Boards PCB's with metal core (Copper, Brass, Aluminium, Invar,..). Many different build-up variations are possible. Ideal to combine high frequency, digital and heat sink in one board. Special PCB's We produce PCB's for various, special applications: Thermally conductive PCB's for High Power circuitry. Electrically conductive adhesive for PCB's with metal strengthening to achieve a good ground connection. The conductive adhesive used is Ablestik. Integrated heat sink for thermally critical components. Impedance controlled PCB's for a consistent signal quality. PCB's with integrated components. Thick copper PCB's for high-current applications.

8 Plugged Vias PCB's for high circuitry density. Special formats meters oversized PCB's Created: ht Approved: so page 8 of 36. 3. Design for manufacturing Generally IPC or Perfag norms are applied. PCB thickness From to 6mm Thickness tolerances according to manufacturer's guide lines Multilayer standard +/-10%. Hole diameter The defined hole diameter of plated-through holes is understood as the final hole diameter after plating. This means that the drill diameter is larger. Defined hole diameter Drill diameter < +0mm + > + For high frequency boards the defined diameter is often understood to be the same as the drill diameter. Please make a note on the drawings accordingly. In the case of non-plated holes, the hole diameter is the same as the drill diameter. Layout Conductor width and annular ring Definition: Annular Ring Pad Diameter Drill Diameter Conductor Width Spacing Created: ht Approved: so page 9 of 36.

9 Outer layer: Standard fine very fine up on Max. agreement copper Width and n/a n/a 75 m <75 m 25 m spacing 200 m 200-150 m 150-100 m <100 m 40 m 250 m 250-200 m 200-150 m - 70 m Annular ring n/a n/a 75 m <75 m 25 m of plated 200 m 200-150 m 150-100 m <100 m 40 m through 250 m 250-200 m 200-150 m - 70 m holes Annular ring n/a n/a n/a n/a 25 m of non-plated 450 m 450-350 m 350-200 m 200-100 m 40 m through 500 m 500-400 m 400-250 m - 70 m holes Inner layer: Pad diameter = Value + Drill diameter. standard fine very fine up on agreement Value + + + + Copper clearance on inner layers: Isolating Distance Clearance Drill Diameter Clearance = drill diameter + + 2x min. isolating distance Clearance: standard fine very fine up on agreement Drill diameter + + + + Created: ht Approved: so page 10 of 36. Annular Ring As we use the tenting method (panel plating) we always need an annular ring of at least Edge plating Needed Annular Ring larger than around edge-plating area.

10 Electro-Plating, plated-through holes, via holes, Via Definition of Aspect ratio The ratio of hole diameter to board thickness or blind hole deepness. Plated-through Via Aspect ratio maximal 1:10 from diameter and larger. Blind via Drill diameter Aspect Ratio 1 1 1:1. z-axis tolerance [mm]. Standard z-axis controlled Contact drilled Buried Vias Are regarded, from a production point of view, like plated-through vias. Plugged Via, Cap Plated Via Void free via plugging with standard paste. Selective and partial plugging possible. With or without cap plating Aspect Ratio up to 1:40. Min. Diameter (plated). Max. Diameter 2mm (and depending on aspect ratio 1:2). Min. panel 100x150mm Max. panel 610x762mm Oversized panel 762x1000mm Via Diameter from to as blind via or plated-through hole (see next chapter). Created: ht Approved: so page 11 of 36. Via Cu-filled Method 1: Only Microvias can be filled with this method.