1 NASA SP-5943(OI)* TESTING METHODS AND TECHNIQUES: TESTING ELECTRICALAND ELECTRONIC DEVICESA COMPILATIONNATIONAL AERONAUTICS AND SPACE 2020-07-20T00:40:13+00:00 ZForewordThe National Aeronautics and Space Administration and the Atomic EnergyCommission have established a Technology Utilization Program for the rapiddissemination of information on technological developments which have potentialutility outside the aerospace and nuclear communities. By encouraging multipleapplication of the results of its research and development, NASA and AECearn for the public an increased return on the public investment in aerospaceand nuclear R&D METHODS , techniques, and devices presented in this compilation areused in TESTING various electrical and electronic apparatus.
2 The items describedrange from semiconductor package leak detectors to automatic circuit analyzersand antenna simulators for system checkout. In many cases, the approachespresented can result in considerable cost savings, together with improved compilation is presented in three sections. The first describes the testingof various electronic components, assemblies, and systems; the second treats thetesting of various electrical devices; and the third deals with the TESTING ofcables and connectors. This compilation is not intended as a complete surveyof the field of electrical and electronic equipment TESTING .
3 Rather, it presents asampling of many diverse activities for the interest of electrical, electronic, andquality control designers and engineers. Its diversity of content may even lendthis compilation some interest as an introduction to the field, for those unfamiliarwith the principals and practices of electrical and electronic equipment technical information on individual devices and techniques canbe requested by circling the appropriate number on the Reader Service Card en-closed in this otherwise stated, neither NASA nor AEC contemplate patent actionon the technology appreciate comment by readers and welcome hearing about the relevanceand utility of the information in this Utilization Of/iceNational Aeronautics and Space AdministrationNOTICE This document was prepared under the sponsorship of the National Aeronautics and SpaceAdministration.
4 Neither the United States Government nor any person acting on behalf of the UnitedStates Government assumes any liability resulting from the use of the information contained in thisdocument, or warrants that such use will be free from privately owned sale by the National Technical Information Service, Springfield, Virginia 22151 Price $ !. TESTING Electronic Components, Assemblies and Systems PageTesting Semiconductors Without Disconnecting Themfrom Circuit 1 Semiautomatic Device Tests Componentswith Biaxial Leads 1 Test and Inspection Techniques for MonolithicCircuit Production 2 Component Package Leak Detection 2 Heating Stage for Scanning Electron
5 Microscope 3 Powdered Styrofoam Substitutes for Potting Material'in Vibration TESTING 4 Tooling Compound Used to Encapsulate SmallComponents for TESTING 4 Vibration Test Detects Intermittent ElectricalFaults 5 Inspection of Potted Cordwood Modules 5 Monopulse-Antenna Simulator 5 Cold- TESTING Printed Circuit Boards 6 Preliminary Isolation Test Protects Low-VoltageCircuits 6 Modified PCB Extender Is Troubleshooting Aid 7 Module-Carrier Design Gives Easy Accesswith Minimum Wear 7 Ventilated Test Enclosure 8 Noise- TESTING Device Facilitates Data
6 AcquisitionSystem Calibration 8 TESTING Power Supply Recovery Time . 9 Automatic Telemetry Checkout System ; .. 9 SECTION 2. TESTING Electrical DevicesIdentification of Thermocouple Materials 10 Thermocouple Resistance Measured WithoutDisconnection from System 10 Measuring Battery Charge Leakage 11 Measuring Set/Release Pressure and Travelof a Circuit Breaker 12 Torque Meter Aids Study of Hysteresis-Motor Rings 12 Recommended Operating Torques for Rotary Controls
7 13DC Motor Commutating Brushes Tested in Dry ArgonAtmosphere 14 Microphone Calibration at High Sound Pressures 14 SECTIONS. TESTING Cables and Connectors pageMoire Pattern Used to Check Flat ConductorCable Spacing 15 Experimental Prediction of Superconducting-CablePerformance 15 Measuring Insulation Mechanical Failure Rates 16 Cable Insulation Resistance Tester 16 Tester Automatically Checks Insulationin Multiconductor Cables
8 17 Shielded Cable Tester 17 Grid-Plate Adapter for Wire Tester 18 Measuring Tensile Loads Induced in Connector Pinsby Cable Bending 18 Measuring the Connect/Disconnect Forces ofan Electrical Connector 19 Measuring RF Leakage from Coaxial Connectors 20 Fuse-Holder Adapter for Ammeter Probe 21 Measuring the Length of Electrical Connector Pins 21 Quick-Connect Device for Monitoring Signalon Barrier-Type Terminal Strips 22 Test Device Prevents Weld-Joint Damage on UnpottedModules 22 Section 1.
9 TESTING Electronic Components,Assemblies and SystemsTESTING SEMICONDUCTORS WITHOUT DISCONNECTING THEMFROM CIRCUITS1ojoooo0oooTransistorUnderTest S~,'-4 LPNPO scilloscope: HorizontalPNPT ransistorNPN NonlinearTransistor TransistorGoodDiodeDiodeReversedIn TesterOpenCircuitShortCircuitAn oscilloscope, together with the test cir-cuitry shown in the figure, can be used to check(Semiconductors that are wired into a transistors, approximate gain and linearitycan be determined; for diodes, open circuits,short circuits, and reversed polarity are indicatedclearly. The quality and breakdown point oflow-voltage (<10 V) zener diodes can be idealized oscilloscope traces show the typesof waveforms to be expected under various cir-cumstances, provided that the impedance of theexternal circuit is much greater than that ofthecomponent under test.)
10 If -this is not so,the waveforms obtained will vary, dependingon the external circuit properties. In either case,when an assembly to be tested contains multipleidentical circuits, the tester may be employedcomparatively to identify a defective : B. C. Allen ofNorth American Rockwell contract toMarshall Space Flight Center(MFS-1163)Circle I on Reader Service DEVICE TESTS COMPONENTSWITH BIAXIAL LEADSThe device shown in the illustration is usedfor enviromental TESTING of electronic componentsequipped with biaxial leads. The components tobe tested are loaded in a slotted clip.