Thick Film Chip Resistors, High Voltage - Vishay

1 Techno Revision: 18-Apr-171 Document Number: 68002 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT film chip Resistors, high VoltageFEATURES high Voltage up to 3000 V Outstanding stability < % Flow solderable Custom sizes available Automatic placement capability Tape and reel packaging available Termination style: 3-sided wraparound termination or single termination flip chip standard; 5-sided wraparound termination available Internationally standardized sizes Suitable for solderable, epoxy bondable, or wire bondable applications Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard.

2 Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available Multiple styles, termination materials and configurations, allow wide design flexibility Epoxy bondable or wire bondable non-magnetic terminations available Material categorization: for definitions of compliance please see *This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant.

3 Please see the information / tables in this datasheet for detailsNotes For non-standard sizes, lower values or higher power rating requirement, contact factory(1)Continuous working Voltage shall be or maximum working Voltage , whichever is less(2)Resistance values below 1 G are calibrated at 100 VDC, and values of 1 G and above are calibrated at 1000 VDC. Calibration at other voltages available upon request(3)Contact factory for tighter tolerances(4)Reference only: not for all values specified. Consult factory for your size and value.

4 The TC for AA option is typically 200 ppmAvailableAvailableSTANDARD ELECTRICAL SPECIFICATIONSGLOBAL MODELCASE SIZEPOWER RATINGP70 CWMAXIMUM WORKING Voltage (1)VRESISTANCERANGE (2) TOLERANCE (3) %TEMPERATURECOEFFICIENT (4)(-55 C to +155 C) ppm/ to 2M to 1G1, 2, 5, 10, 20 to 8G2, 5, 10, 20 to 4M to 1G1, 2, 5, 10, 20 to 10G2, 5, 10, to 6M to 1G1, 2, 5, 10, 20 to 10G2, 5, 10, 20 11G to 35G 5, 10, to 10M to 1G1, 2, 5, 10, to 10G2, 5, 10, 20 11G to 40G 5, 10, to 12M to 1G1, 2, 5, 10, 20 to 10G2, 5, 10, 20 11G to 50G 5, 10, 20P x Techno Revision: 18-Apr-172 Document Number: 68002 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

5 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT For additional information on packaging, refer to the Surface Mount resistor Packaging document ( )Note Reference only: Not for all values specified. Consult factory for your size and valueGLOBAL PART NUMBER INFORMATIONNew Global Part Numbering: CRHV1206AF100 MFKFB (preferred part number format)GLOBALMODELSIZETERMINALSTYLETERMI NALMATERIALRESISTANCE VALUETOLERANCETCRSOLDER TERMINATIONPACKAGINGCRHV1206121020102510 2512A = 3-sidedB = top onlyC = 5-sidedF = nickel barrierG = non-magneticA = palladium silverB = platinum goldC = goldD = platinum silverE = platinum palladium goldM = M G = G 4M70 = M 10M0 = 10 M 1G00 = 1 G D = %F = 1 %G = 2 %J = 5 %K = 10 %M = 20 %K = 100 ppmL = 150 ppmN = 200 ppmR = 250 ppmM = 300 ppmW = 350 ppmP = 500 ppmE = Sn100F = Sn95/Ag5, HSDN = No solderS = Sn62/Pb36/Ag2.

6 HSDT = Sn90/Pb10B = bulkF = T/R(full reel)1 = T/R(1000 pcs)5 = T/R(500 pcs)T = T/R(250 pcs min.)W = waffle trayHistorical Part Numbering: CRHV1206AF1006F100e2 (will continue to be accepted)CRHV1206AF1006F100e2 HISTORICAL MODELSIZETERMSTYLETERM MATERIALRESISTANCE VALUETOLERANCETCRSOLDER TERMINATIONMECHANICAL SPECIFICATIONSR esistive elementRuthenium oxideEncapsulation GlassSubstrate 96 % aluminaTerminationSolder-coated nickel barrier or solder coated non-magnetic terminations standard. Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold terminations finishPure tin or tin/lead solder alloys standard.

7 Tin/silver or tin/lead/silver solderalloys SPECIFICATIONSO perating temperature-55 C to +155 CLifeLess than % change when testedat full rated powerShort time overloadLess than % RDERATING CURVE- 55- 250255075 100 12515517512070 Ambient Temperature in CRated Power in %100806040200 Voltage COEFFICIENT OF RESISTANCE CHARTSIZE VALUE ( ) VCR (ppm/V) FURTHER INSTRUCTIONS CRHV1206 2M to 199M 25 Values over 200M, consult factoryCRHV1210 4M to 200M 25 Values over 200M, consult factoryCRHV2010 6M to 99M15 Values over 1G, consult factory100M to 1G 20 CRHV2510 10M to 99M10 Values over 1G, consult factory100M to 1G 15 CRHV2512 12M to 999M10 Values over 5G, consult factory1G to 5G 25 Techno Revision: 18-Apr-173 Document Number: 68002 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

8 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT (1)Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting(2)While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues(3)Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T.

9 Hot solder dipped terminations F or S are also availableNote This summary is based on testing done on values up to 2 G DIMENSIONS in inches (millimeters)MODEL LENGTH (L) ( ) WIDTH (W) ( ) THICKNESS (T) ( ) CRHV1206 CRHV1210 CRHV2010 CRHV2510 CRHV2512 TYPETERMINATION MATERIALTERMINATIONSTYLETERMINATION STYLE/MATERIAL CODESOLDER TERMINATION CODES olderableNickel barrier3-sided (wraparound)AFE or T (standard).

10 F or S (optional) (3)Top only (flip chip )BF5-sided (wraparound)CFNon-magnetic3-sided (wraparound)AGE or T (standard);F or S (optional) (3)Top only (flip chip )BGEpoxy bondable/ solderablePlatinum palladium gold3-sided (wraparound)AEN (standard);F or S (optional) (1)Top only (flip chip )BE5-sided (wraparound)CEWire bondable/ Epoxy bondableGold3-sided (wraparound)ACNTop only (flip chip )BC5-sided (wraparound)CCEpoxy bondablePalladium silver (2)3-sided (wraparound)AANTop only (flip chip )BA5-sided (wraparound)CAPlatinum gold3-sided (wraparound)ABTop only (flip chip )BB5-sided (wraparound)CBPlatinum silver3-sided (wraparound)ADTop only (flip chip )BD5-sided (wraparound)CDPERFORMANCETESTCONDITIONS OF TESTTEST RESULTS (TYPICAL TEST LOTS)