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Thick Film General Purpose chip resistors - passive component

Approval sheet WR01X. 5%, 1%. Thick film General Purpose chip resistors Size 01005. *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet FEATURE. 1. Ultra small and high precision size and light weight 2. High reliability and stability 3. Reduced size of final equipment 4. Suitable for high density print circuit board assembly 5. Higher component and equipment reliability 6. Lead free product APPLICATION. Mobile phone PDA, MP3, Ipod, iPHONE. DSC, DVs Palmtop computers Mini module DESCRIPTION. The resistors are constructed in a high grade ceramic body (aluminum oxide).

Approval sheet Page 3 of 8 ASC_WR01X_V06 JAN - 2017 QUICK REFERENCE DATA

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Transcription of Thick Film General Purpose chip resistors - passive component

1 Approval sheet WR01X. 5%, 1%. Thick film General Purpose chip resistors Size 01005. *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet FEATURE. 1. Ultra small and high precision size and light weight 2. High reliability and stability 3. Reduced size of final equipment 4. Suitable for high density print circuit board assembly 5. Higher component and equipment reliability 6. Lead free product APPLICATION. Mobile phone PDA, MP3, Ipod, iPHONE. DSC, DVs Palmtop computers Mini module DESCRIPTION. The resistors are constructed in a high grade ceramic body (aluminum oxide).

2 Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to nominated value within tolerance which controlled by laser trimming of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a pure Tin. Fig 1. Construction of chip -R WR01X. Page 2 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet QUICK REFERENCE DATA.

3 Item General Specification Series No. WR01X. Size code 01005 (0402). Resistance Range ~ 1M ( 5%, 1%), Jumper Resistance Tolerance 1% 5%. E96/E24 E24. TCR (ppm/ C) 100 - 1M , 200 ppm 10 - 91 , 300 ppm - , +600~ -200 ppm Max. dissipation 1/32 W. Tamb=70 C. Max. Operation Voltage 15V. (DC or RMS). Max. Overload Voltage 30V. (DC or RMS). Climatic category (IEC. 55/125/56. 60068). Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see IEC publication 60115-8 . 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by RCWV RatedPower Resistance Value or Max.

4 RCWV listed above, whichever is lower. DIMENSION(unit : mm). Protec tive c oat WR01X T. End termination L Tb W Tt Resistive layer T Ceramic Substrate Tb W T. Tt L. MARKING. WR01X has no marking. Page 3 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet FUNCTIONAL DESCRIPTION. Product characterization Standard values of nominal resistance are taken from the E24/E96 series for resistors with a tolerance of 5%. & 1%. The values of the E24/E96 series are in accordance with IEC publication 60063 . Derating The power that the resistor can dissipate depends on the operating temperature; see Figure 2. Maximum dissipation in percentage of rated power As a function of the ambient temperature MOUNTING.

5 Due to its rectangular shape and ultra small size, Surface Mountable resistors 01005 should be carefully handling by automatic placement systems. 01005 chip can withstand pressure force min. by applying pressure jig as shown drawing below. For mounting application, please contact Walsin group for details. Pressure Pressure jig chip W. L. L. L W. SOLDERING CONDITION. The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 C for 10. seconds. Therefore, it is possible to mount Surface Mount resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs).

6 Surface Mount resistors are tested for solderability at 245 C during 3 seconds. The test condition for no leaching is 260 C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile for chip resistors WR01X. Page 4 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet CATALOGUE NUMBERS. The resistors have a catalogue number starting with : WR01 X 472_ J D L. Size code Type code Resistance code Tolerance Packaging code Termination code WR01 : 01005 X : Normal 5% E24 : 2 significant J : 5% D : 7 Reeled paper L = Sn base digits followed by no.

7 Taping (20 Kpcs/Reel) (lead free). W : 1%, < 10ohm of zeros and a blank F : 1%. L : 7 Reeled =4R7_ P : Jumper embossed taping (35 Kpcs/Reel). 10 =100_. 220 =221_. Jumper =000_. ( _ means a blank). 1%, E24+E96: 3 significant digits followed by no. of zeros 100 =1000. =3742. Page 5 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet TEST AND REQUIREMENTS (JIS C 5201-1 : 1998). REQUIREMENT. TEST PROCEDURE / TEST METHOD. resistor 0 . DC resistance DC resistance values measured at the test voltages specified below : Within the specified Clause <50m . <10 <100 <1K tolerance <10K @3V, <100K @10V, <1M @25V, <10M Temperature Coefficient Natural resistance change per change in degree centigrade.

8 Refer to of Resistance( ) QUICK REFERENCE DATA . R2 R1. 106. R1 t2 t1 . Clause (ppm/ C) t1 : 20 C+5 C-1 C. N/a R1 : Resistance at reference temperature R2 : Resistance at test temperature Short time overload Permanent resistance change after a 2 second application ( ) of a voltage times RCWV or the maximum overload R/R max. (1%+ ) <50m . Clause voltage specified in the above list, whichever is less. Resistance to soldering Un-mounted chips completely immersed for 10 R/R max. (1%+ ). heat( ) in a SAC solder bath at 260 5 C <50m . no visible damage IEC 60068-2-58: 2004. Solderability Un-mounted chips completely immersed for 2 in 95% coverage min.

9 , good tinning and no a SAC solder bath at 235 5 visible damage IEC 60068-2-58: 2004. Temperature cycling 30 minutes at -55 C 3 C, 2~3 minutes at 20 C+5 C-1 C, 30. minutes at +125 C 3 C, 2~3 minutes at 20 C+5 C-1 C, R/R max. (1%+ ) < 50m . Clause total 5 continuous cycles Damp Heat 1000+48/-0 hours, loaded with RCWV or Vmax in humidity R/R max. (5%+ ). (Load life in humidity) chamber controller at 40 C 2 C and 90~95% relative no visible damage < 50m . Clause humidity, Load Life (Endurance) 1000+48/-0 hours; loaded with RCWV or Vmax in chamber R/R max. (5%+ ). < 50m . Clause controller 70 2 C, hours on and hours off no visible damage Endurance at the upper 125 C, no load, 1000 hours R/R max.

10 (5%+ ) < 50m . category temperature no visible damage Bending strength resistors mounted on a 90mm glass epoxy resin PCB(FR4), No visual damage, < 50m . Clause bending once 3mm for 10sec. R/R max. (1%+ ). Adhesion Pressurizing force: 2N, Test time: 10 1sec. No visual damage Clause Page 6 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet PACKAGING. 1. Paper Tape specifications (unit :mm). t1. Series No. A B W F E. WR01X Series No. P1 P0 D t1 T. WR01X 2. Embossed Narrow Tape specifications ( unit: mm ). Series No. A B W E. WR01X Reel dimensions Page 7 of 8 ASC_WR01X_V06 JAN - 2017. Approval sheet Symbol A B C D. (unit : mm) Paper tape: +1/-0.


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