TLE208x, TLE208xA, TLE208xY EXCALIBUR HIGH …

1 tle208x , tle208xa , TLE208xYEXCALIBUR high - speed jfet -INPUTOPERATIONAL AMPLIFIERSSLOS182B FEBRUARY 1997 REVISED JUNE 20011 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 DDirect Upgrades to TL05x, TL07x, andTL08x BiFET operational AmplifiersDGreater Than 2 Bandwidth (10 MHz) and3 Slew Rate (45 V/ s) Than TL08xDOn-Chip Offset Voltage Trimming forImproved DC PerformanceDWider Supply Rails Increase DynamicSignal Range to 19 V descriptionThe tle208x series of jfet - input operational amplifiers more than double the bandwidth and triple the slewrate of the TL07x and TL08x families of BiFET operational amplifiers.

2 The tle208x also have widersupply-voltage rails, increasing the dynamic-signal range for BiFET circuits to 19 V. On-chip zener trimmingof offset voltage yields precision grades for greater accuracy in dc-coupled applications. The tle208x arepin-compatible with lower performance BiFET operational amplifiers for ease in improving performance inexisting operational amplifiers offer the inherently higher input impedance of the jfet - input transistors, withoutsacrificing the output drive associated with bipolar amplifiers.

3 This makes these amplifiers better suited forinterfacing with high -impedance sensors or very low level ac signals. They also feature inherently better acresponse than bipolar or CMOS devices having comparable power BiFET operational amplifiers are designed for use with dual power supplies, care must be taken toobserve common-mode input -voltage limits and output voltage swing when operating from a single supply. DCbiasing of the input signal is required and loads should be terminated to a virtual ground node at Instruments TLE2426 integrated virtual ground generator is useful when operating BiFET amplifiers fromsingle tle208x are fully specified at 15 V and 5 V.

4 For operation in low-voltage and/or single-supply systems,Texas Instruments LinCMOS families of operational amplifiers (TLC- and TLV-prefix) are moving from BiFET to CMOS amplifiers, particular attention should be paid to slew rate and bandwidthrequirements and output BiFET circuits requiring low noise and/or tighter dc precision, the TLE207x offer the same ac response asthe tle208x with more stringent dc and noise 2001, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication conform to specifications per the terms of Texas Instrumentsstandard warranty.

5 Production processing does not necessarily includetesting of all be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data is a trademark of Texas , tle208xa , TLE208xYEXCALIBUR high - speed jfet -INPUTOPERATIONAL AMPLIFIERSSLOS182B FEBRUARY 1997 REVISED JUNE 20012 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 TLE2081 AVAILABLE OPTIONSPACKAGED DEVICESCHIPTAVIOmaxAT 25 CSMALLOUTLINE(D)CHIPCARRIER(FK)CERAMICDI P(JG)PLASTICDIP(P)CHIPFORM (Y)0 Cto70 C3 mVTLE2081 ACDTLE2081 ACP 0 C to 70 C6 mVTLE2081CD TLE2081 CPTLE2081Y40 Cto85 C3 mVTLE2081 AIDTLE2081 AIP 40 C to 85 C6 mVTLE2081ID TLE2081IP 55 Cto125 C3 mVTLE2081 AMFKTLE2081 AMJG 55 C to 125 C6 mV TLE2081 MFKTLE2081 MJG The D packages are available taped and reeled.

6 Add R suffix to device type ( , TLE2081 ACDR). Chip forms are tested at TA = 25 C AVAILABLE OPTIONSPACKAGED DEVICESTAVIOmaxAT 25 CSMALLOUTLINE(D)CHIPCARRIER(FK)CERAMICDI P(JG)PLASTICDIP(P)CHIP FORM(Y)0 Cto70 C4 mVTLE2082 ACDTLE2082 ACP0 C to 70 C7 mVTLE2082CD TLE2082CP 40 Cto85 C4 mVTLE2082 AIDTLE2082 AIPTLE2082Y 40 C to 85 C7 mVTLE2082ID TLE2082 IPTLE2082Y55 Cto125 C4 mVTLE2082 AMDTLE2082 AMFKTLE2082 AMJGTLE2082 AMP 55 C to 125 C7 mVTLE2082 MDTLE2082 MFKTLE2082 MJGTLE2082MP The D packages are available taped and reeled.

7 Add R suffix to device type ( , TLE2082 ACDR). Chip forms are tested at TA = 25 C AVAILABLE OPTIONSPACKAGED DEVICESCHIPTAVIOmaxAT 25 CSMALLOUTLINE(DW)CHIPCARRIER(FK)CERAMICD IP(J)PLASTICDIP(N)CHIPFORM (Y)0 Cto70 C4 mVTLE2084 ACDWTLE2084 ACN 0 C to 70 C7 mVTLE2084 CDW TLE2084 CNTLE2084Y55 Cto125 C4 mVTLE2084 AMFKTLE2084 AMJ 55 C to 125 C7 mV TLE2084 MFKTLE2084MJ The DW packages are available taped and reeled. Add R suffix to device type ( , TLE2084 ACDWR). Chip forms are tested at TA = 25 C , tle208xa , TLE208xYEXCALIBUR high - speed jfet -INPUTOPERATIONAL AMPLIFIERSSLOS182B FEBRUARY 1997 REVISED JUNE 20013 POST OFFICE BOX 655303 DALLAS, TEXAS 7526512348765 OFFSET N1IN IN +VCC NCVCC +OUTOFFSET N23 2 1 20 19910111213456781817161514 NCVCC +NCOUTNCNCIN NCIN +NCNCOFFSET N1 NCNCNCNCV NCOFFSET N2 NCCC TLE2081D, JG, OR P PACKAGE(TOP VIEW)TLE2081FK PACKAGE(TOP VIEW)

8 123487651 OUT1IN 1IN +VCC VCC+2 OUT2IN 2IN+3212019910111213456781817161514NC2 OUTNC2IN NCNC1IN NC1IN+NCNC1 OUTNCNCNCNCVNC2IN +CC VCC +TLE2082D, JG, OR P PACKAGE(TOP VIEW)TLE2082FK PACKAGE(TOP VIEW)3212019910 11 12 134567818171615144IN +NCVCC NC3IN +1IN+NCVCC+NC2IN+TLE2084FK PACKAGE(TOP VIEW)1IN 1 OUTNC3IN 4IN 2 IN NC3 OUT2 OUT4 OUT1234 56781615141312111091 OUT1IN 1IN +VCC +2IN +2IN 2 OUTNC4 OUT4IN 4IN +VCC 3IN +3IN 3 OUTNC1234 5671413121110981 OUT1IN 1IN +VCC +2IN +2IN 2 OUT4 OUT4IN 4IN +VCC 3IN +3IN 3 OUTTLE2084J OR N PACKAGE(TOP VIEW)TLE2084DW PACKAGE(TOP VIEW)

9 NC No internal connectionsymbol+ OUTIN +IN tle208x , tle208xa , TLE208xYEXCALIBUR high - speed jfet -INPUTOPERATIONAL AMPLIFIERSSLOS182B FEBRUARY 1997 REVISED JUNE 20014 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 TLE2081Y chip informationThis chip, when properly assembled, displays characteristics similar to the TLE2081. Thermal compression orultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductiveepoxy or a gold-silicon PAD ASSIGNMENTSCHIP THICKNESS: 15 TYPICALBONDING PADS: 4 4 MINIMUMTJmax = 150 CTOLERANCES ARE 10%.

10 ALL DIMENSIONS ARE IN (4) IS INTERNALLY CONNECTEDTO BACKSIDE OF THE CHIP.+ OUT IN +IN VCC+(6)(3)(2)(5)(1)(7)(4)OFFSET N1 OFFSET N2 VCC 5885(1)(2)(4)(5)(6)(7)(8)(3) tle208x , tle208xa , TLE208xYEXCALIBUR high - speed jfet -INPUTOPERATIONAL AMPLIFIERSSLOS182B FEBRUARY 1997 REVISED JUNE 20015 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 TLE2082Y chip informationThis chip, when properly assembled, displays characteristics similar to the TLE2082. Thermal compression orultrasonic bonding may be used on the doped-aluminum bonding pads.