Transcription of めっき皮膜の腐食と分析 - tri-osaka.jp
1 11 2 23 DuPont Comp. Report)4 , , H2O,O2M Mn++e2 H2O+O2+e OH-35 O2H+ 6 Fe2+ Fe Fe2++2e- 1/2O2+H2O+2e- 2OH-OH-O2 Fee- 47 I II 100 III IV 8 59 RCl-R-OH RR SOx 10
2 2802852902950200040006000800010000 Binding Energy (eV)c/sAR1111 10c/sH2 ONi -OHNi -OBinding Energy (eV)AR1111 104 Binding Energy (eV)c/sNi -ONiAR1111~ -OH 611 12 35 55 65 Sox 70 78 100 713 14 (Ni/Au Cu2S Sn Cu Ag Ni Zn 815 16 917 Cu/Ni/Cr EDX18 1019)
3 A..Cu a. Ni I. B..Ni b. 2. Cr ii. C. c. Ni 3. Ni D. 7. (2) (1) 20 1121 22 : Au contact Area TRI +005 minSur1/ Energy (eV)c/s -O KLL -Cu2p3 -Cu LMM -Au4p1 -Cu LMM -Au4p3 -O1s -Au4d3 -Au4d5 -C1s -Au4f 7 -Ni2p3 AuNiCu XPS ESCA1223 Sn-Co Sn-Ni Cu-Sn Cu-Zn Cu-Zn-Sn * Sn-Ni Cu-Zn * 24 24 48 72 96 120 144 168 192 216 500 0000245 0245 0000025 5 JIS H 8610 1325 Zn < < < ( 10 20% )
4 26 1427 46,99 1997 28 1529 S !!S ( ) > S ( )>S ( )( 1 m)30Ni S ( ) > S ( ) >S ( )1631 / : 32 ( m ) 2 40 /cm2 400 600 /cm100 m100 m1733 SO2Sn Zn (Al) (Sn-Pb)Ag Ni Cr Au (Cu) (SUS)NiNO2Au A (SUS) Ag Ni Sn Zn (Cu)H2S Au Sn Rh Zn (Al) (Sn-Pb)Ni Ag-SnNi/Cr(Cu) (Ag)Cl2Ag Ni (Sn-Pb) Sn Zn (Cu) SUS)NH3Ag Ni Sn Zn (SUS)(Cu) (Sn-Pb) Cu) (A )
5 34 1835 36 Cl-,NO3-,SO42-,S2- H2S,NOx,SOxHCl,Cl2 1937 1keV1eV X 1000cm-110cm-11GH 1010Hz100 MHz 38 TRI XPSAESFTIRR amanSIMSRBSPIXEXRDEPMASEMAFMSTMTEMXFS GDS
6 2039 X ESCA, XPS) AES SIMS nm X X Ar XYZ ATOMIKA SIMS 400040 X EPMA) GDS OES m m WDX JXA-8800 EDX ERAX30002141 X ICP 42 X X X X X 2243 44 nmESCA AES
7 SIMS GDS XRD XFR RBS ICP FT-IR GC-MS 2345 46 1 10 100110 Distance (XY)Depth (Z)1 10 100 1000110110100( m)(mm)(nm)( m)(nm)SIMSEPMAGDSRBSSAM,AESFT -IRESCAXRDXRF2447 110110100( m)(mm)SIMSSAM,AESXRF10210-1110-210-310-4 10-510-610100 EPMA ESCA (ppm) 48 SEMSSiCuEDX2549 ESCA50 ESCA010020030040050060070080090010000246 81012x 104 Binding Energy (eV) -Zn2p1 -Zn2p3 -O KLL -Cu2p3 -CuLMM -ZnLMM -O 1s -N 1s -C 1s -ZnLM M -ZnLMM -Cu3p39540040541041515002000250030003500 4000 Binding Energy (eV) ESCA570580590600246020004000 Binding Energy (eV)850860870880890246020004000 Binding Energy (eV)c/s700710720730740246012x 1 04 Binding Energy (eV)c/sFe 2p35255305355405452460500010000 Binding Energy (eV)c/sO1s5255305355405452460500010000 Binding Energy (eV)0%20%40%60%80%100%0 1 Time (min)Concentratin (at%)COFe(M)Cr(M)NiCr-OFe-O 52 + Wood (1um)
8 012345602040 Time (s)Int. ( )O C FeNiCr (1um)012345602040 Time (s)Int. ( )O C FeNiCr SUS GDS2753 ClCuNiArea AArea BOCEDX54 : Durty Au contact Area TRI Osaka05 Jun 3 Al mono W +005 minSur1/Full/110020030040050060070080090 010001100051015x Energy (eV)c/s -O KLL -O KLL -F KLL -F1s -O1s -N1s -C1s -Cl2p -Si2s -Cu LMM3 -Cu LMM1 -Cu3p -Cu2p -Cu3p -Si2pESCA2855 EDX56 : coloured Ag TRI Osaka05 Jun 3 Al mono W +005 sSur1/Full/11002003004005006007008009001 000110001234567x Energy (eV)c/s -O KLL -I MNN -Ag3s -I3d3 -I3d5 -Ag3p1 -Ag3p3 -O1s -Ag3d5 -C1s -Cl2s -S2s -Cl2p -S2p -Ag4s -Ag4p -Se3d-Ag4dESCA2957.
9 Coloured Ag TRI Osaka05 Jun 3 Al mono W +000 maxNa1 Time (min)Atomic Concentration (%)C1sO1sS2pCl2pAg3dNa1s58 ( ) 3059
