TS 102 671 - V9.0.0 - Smart Cards; Machine to …

1 ETSI TS 102 671 (2010-04)Technical Specification Smart Cards; Machine to Machine UICC;Physical and logical characteristics(Release 9) ETSI ETSI TS 102 671 (2010-04)2 Release 9 Reference DTS/SCP-T090071v900 Keywords M2M, MFF ETSI 650 Route des Lucioles F-06921 Sophia Antipolis Cedex - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Siret N 348 623 562 00017 - NAF 742 C Association but non lucratif enregistr e la Sous-Pr fecture de Grasse (06) N 7803/88 Important notice Individual copies of the present document can be downloaded from: The present document may be made available in more than one electronic version or in print.

2 In any case of existing or perceived difference in contents between such versions, the reference version is the Portable Document Format (PDF). In case of dispute, the reference shall be the printing on ETSI printers of the PDF version kept on a specific network drive within ETSI Secretariat. Users of the present document should be aware that the document may be subject to revision or change of status. Information on the current status of this and other ETSI documents is available at If you find errors in the present document, please send your comment to one of the following services: Copyright Notification No part may be reproduced except as authorized by written permission.

3 The copyright and the foregoing restriction extend to reproduction in all media. European Telecommunications Standards Institute 2010. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTM, TIPHONTM, the TIPHON logo and the ETSI logo are Trade Marks of ETSI registered for the benefit of its Members. 3 GPPTM is a Trade Mark of ETSI registered for the benefit of its Members and of the 3 GPP Organizational Partners. LTE is a Trade Mark of ETSI currently being registered for the benefit of its Members and of the 3 GPP Organizational Partners. GSM and the GSM logo are Trade Marks registered and owned by the GSM Association.

4 ETSI ETSI TS 102 671 (2010-04)3 Release 9 Contents Intellectual Property Rights .. 5 Foreword .. 5 1 Scope .. 6 2 References .. 6 Normative references .. 6 Informative references .. 7 3 Definitions and abbreviations .. 7 Definitions .. 7 Abbreviations .. 7 4 Overview .. 8 5 Definition of Environmental 8 Environmental condition classification system .. 8 Operational and Storage Temperature (TX).

5 8 Temperature (TS) -25 C to +85 C .. 9 Temperature (TA) -40 C to +85 C .. 9 Temperature (TB) -40 C to +105 C .. 9 Temperature (TC) -40 C to +125 C .. 9 Moisture/Reflow conditions (MX) .. 9 Moisture/Reflow conditions (MA) .. 9 Humidity (HX) .. 9 Humidity (class HA) - High humidity .. 9 Corrosion (CX) .. 9 Corrosion (CA to CD) - Salt atmosphere .. 10 Vibration (VX) .. 10 Vibration (VA) - Automotive vibration.

6 10 Fretting Corrosion (FX) .. 10 Fretting Corrosion (FA) - Connector 10 Shock (SX) .. 10 Shock (SA) - Automotive shock .. 10 Data Retention Time (RX) .. 10 Data Retention Time (RA) - 10 years .. 10 Data Retention Time (RB) - 12 years .. 11 Data Retention Time (RC) - 15 years .. 11 Minimum Updates (UX) .. 11 Minimum Updates (UA) - 100 000 .. 11 Minimum Updates (UB) - 500 000 .. 11 Minimum Updates (UC) - 1 000 000 .. 11 6 M2M UICC - Physical Characteristics .. 11 General M2M UICC physical characteristics.

7 11 Contacts .. 11 Specific MFF physical characteristics .. 11 MFF1 .. 12 Orientation mark for the bottom of the package .. 13 Orientation mark for top of package .. 13 MFF2 .. 14 Orientation mark for the bottom of the package .. 14 Orientation mark for top of package .. 15 7 Electrical and Logical specifications of the MFF UICC - Terminal interface .. 15 Voltage Class support .. 15 8 Device Pairing Mechanism .. 15 Secure Channel Pairing.

8 15 ETSI ETSI TS 102 671 (2010-04)4 Release 9 CAT application pairing .. 16 Annex A (informative): PCB layout for the MFF .. 17 Annex B (informative): Change history .. 19 Annex C (informative): Change history .. 20 History .. 21 ETSI ETSI TS 102 671 (2010-04)5 Release 9 Intellectual Property Rights IPRs essential or potentially essential to the present document may have been declared to ETSI. The information pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found in ETSI SR 000 314: "Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in respect of ETSI standards", which is available from the ETSI Secretariat.

9 Latest updates are available on the ETSI Web server ( ). Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web server) which are, or may be, or may become, essential to the present document. Foreword This Technical Specification (TS) has been produced by ETSI Technical Committee Smart card Platform (SCP). The contents of the present document are subject to continuing work within TC SCP and may change following formal TC SCP approval.

10 If TC SCP modifies the contents of the present document, it will then be republished by ETSI with an identifying change of release date and an increase in version number as follows: Version where: x the first digit: 0 early working draft; 1 presented to TC SCP for information; 2 presented to TC SCP for approval; 3 or greater indicates TC SCP approved document under change control. y the second digit is incremented for all changes of substance, technical enhancements, corrections, updates, etc. z the third digit is incremented when editorial only changes have been incorporated in the document.