Example: stock market

UP Squared DatasheetV0

2 specification 1x MIPI-CSI 1x MIPI-CSI 1x eDP 2X USB LPDDR4. 2-lane 4-lane 2X UART. Power button 5V DC-IN. Power Jack 2x USB 40 Pin GP-Bus Intel Celeron /. Intel Pentium /. 1x HDMI eMMC Intel Atom . 1x DP Apollo Lake CPU. mini-PCI-Express x1. JTAG for FPGA. 4x LED. 2x Gb Ethernet Altera Max 10. 1x USB RTC Power Reset pin header Power pin header SATA3 2230/E-key USB OTG 60-pin EXHAT Fan power SATA Power UP2 (UP Squared ) is world's fastest maker board with the high performance UP2 (UP Squared ) comes with 2GB/4GB/8GB LPDDR4 and and low power consumption features of Intel Celeron , Pentium and 32GB/64GB/128GB eMMC.

specification www.up-board.org /www.up-shop.org / www.up-community.org - Applications UP2 (UP Squared) is world's fastest maker board with the high performance and ...

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Transcription of UP Squared DatasheetV0

1 2 specification 1x MIPI-CSI 1x MIPI-CSI 1x eDP 2X USB LPDDR4. 2-lane 4-lane 2X UART. Power button 5V DC-IN. Power Jack 2x USB 40 Pin GP-Bus Intel Celeron /. Intel Pentium /. 1x HDMI eMMC Intel Atom . 1x DP Apollo Lake CPU. mini-PCI-Express x1. JTAG for FPGA. 4x LED. 2x Gb Ethernet Altera Max 10. 1x USB RTC Power Reset pin header Power pin header SATA3 2230/E-key USB OTG 60-pin EXHAT Fan power SATA Power UP2 (UP Squared ) is world's fastest maker board with the high performance UP2 (UP Squared ) comes with 2GB/4GB/8GB LPDDR4 and and low power consumption features of Intel Celeron , Pentium and 32GB/64GB/128GB eMMC.

2 A 40-pin GP-bus provides the freedom for Atom Processors (codename Apollo Lake). makers to build up their module. Additionally, there is a 60-pin EXHAT for embedded applications. This allows for the exploration of more possibilities. The internal GPU is the new Intel Gen 9 HD with 12 / 18 Execution Units, The expansion capabilities of UP2 (UP Squared ) goes much further than this. supporting 4K Codec Decode and Encode for HEVC4, and VP8. Native mini-PCI-e, 2230 and SATA3 are all built in on the board. What Thanks to the Vector Units Image Processing Unit and Precision Timing Manage- more could one desire?

3 Ment to synchronize CPU with I/O, improved determinism (cache QoS, Intel Virtualization Technology), all the graphic processing is effortless to UP2 (UP The board supports Windows 10, Windows IoT Core, Ubilinux, Ubuntu, Yocto Squared ). and Android Marshmallow. It's really UP to you to decide which operating system is best for your application. Now, all you need is an UP2 (UP Squared ) to begin your project! - Applications Drones Education Robotics Media Center Internet of Things Home Automation / 2. - Specifications SOC Memory Intel Celeron N3350 (up to GHz) 2GB ( single channel) LPDDR4.

4 Intel Pentium N4200 (up to GHz) 4GB/8GB ( dual channel) LPDDR4. Intel Atom E3940 (up to ) Storage Capacity 32 GB / 64 GB / 128 GB eMMC. Graphics Intel Gen 9 HD, supporting 4K Codec Decode and USB. Intel HD Graphics Encode for HEVC4, , VP8 3x (Type A) + 1x USB OTG (Micro B). 2x +2 X UART (Tx/Rx) debug port ( pin header). Video & Audio HDMI x1 4K @ 30 hz + DP 4K @ 60 hz Ethernet I2S audio port 2x Gb Ethernet (full speed, Realtek 8111G) RJ-45. RTC. Camera interface Yes MIPI-CSI2 2-lane (2MP) + MIPI-CSI2 4-lane ( 8MP).

5 Expansion Display interface 40 pin General Purpose bus + 4-channel 12-bit A/D. eDP converter (500 ksps to 1 Msps). 60 pin EXHAT. Power 1xmini-PCIe (full-size, auto switch to m-SATA). 5V DC-in @ 4A-6A. 2230, SATA3. Operating humidity Compatible Operating system 0% ~ 90% relative humidity, non-condensing Microsoft Windows 10 (full), Windows IOT Core, Linux (ubilinux, Ubuntu, Yocto), Android Marshmallow Operating Tempature 32-140 F / 0~60 C Dimensions " x " / mm 90 mm Altera MAX 10 FPGA. Certificate . 2 KLE --Celeron/ Pentium CE/FCC Class A, RoHS compliant, REACH.

6 4 KLE -- ATOM. eMMC eMMC 1x64b 2400 MHz LPDDR4. 16/32/64/128 GB 2/4/8 GB. Flash Rom Fast SPI LPC, 2xl2C, DMIC, SPI. with header EXHAT. 20x FPGA GPIOs PCI-E Port 1 2xl2C, 2xUART. Realtek 8111G 2x PWM, GPIOs HAT 40 pin Altera Max 10. l2S, 2xSPI, SDIO 2*20 header Dual RJ-45 lSH-port Stack Connector PCI-E Port 2. Realtek 8111G. Apollo Lake ADC*. DDI0. HDMI Type A. HDMI 3840 x 2160. CEC 31 mm x 24 mm PWM2. Fan connector HDMI + DP. Stack Connector DP DDI1. 4096 x 2160 @ 60 hz Port 0. USB - Micro B OTG. Port 0. Hi-speed conn eDP.

7 41 pin with back light control Port 1, 2. USB Type A-1. Hi-speed conn MIPI CSI2 Port 1, 2. dual stack connector 21 pin Port 3. Hi-speed conn MIPI CSI2 USB Type A-2. Port 3. 31 pin dual stack connector USB Port 4 PCI-E Port 0. Mini PCI-E. 2230 E-Key Port 5 & LPC. PCI-E Port 3 full size l2C l2S UART. SDIO Mux with FPGA Port 6, 7. SATA Gen3 x1 UART Port 0 10 pin header SATA600 (Port 0). 2. - Pinout 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40. 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39. 1 3V3 2 5V 3 GPIO0/ I2C1_SDA 4 5V 5 GPIO1/ I2C1_SCL.

8 6 Ground 7 GPIO2/ ADC*_in1 8 GPIO15/ UART_TXD 9 Ground 10 GPIO16/ UART_RXD. 11 GPIO3/ UART_RTS/ SPI_2_FS1*/ ADC*_in2 12 GPIO17/ I2S_BCLK/ SPI_2_FS0* 13 GPIO4/ ADC*_in3 14 Ground 15 GPIO5/ ADC**_in4. 16 GPIO18 17 3V3 18 GPIO19 19 GPIO6/ SPI_1_TXD 20 Ground 21 GPIO7/ SPI_1_RXD 22 GPIO20 23 GPIO8/ SPI_1_CLK 24 GPIO21/ SPI_1_FS0 25 Ground 26 GPIO22/ SPI_1_FS1 27 GPIO9/ I2C0_SDA 28 GPIO23/ I2C0_SCL 29 GPIO10 30 Ground 31 GPIO11 32 GPIO24/ PWM0 33 GPIO12/ PWM1 34 Ground 35 GPIO13/ I2S_WS_SYNC/ SPI_2_RXD*. 36 GPIO25/ UART_CTS/ SPI_2_FS2* 37 GPIO14 38 GPIO26/ I2S_SDI/ SPI_2_TXD* 39 Ground 40 GPIO27/ I2S_SDO/ SPI_2_CLK*.

9 * 2nd SPI and ADC will be available only with E3940 SoC. Part number : UPS-APLC2-A10-0232 Intel Celeron N3350 - 2 GB + 32 GB eMMC UPS-APLP4-A10-0432 Intel Pentium N4200 - 4GB DDR4 + 32GB eMMC. UPS-APLC2-A10-0432 Intel Celeron N3350 - 4 GB + 32 GB eMMC UPS-APLP4-A10-0864 Intel Pentium N4200 - 8GB DDR4 + 64GB eMMC. UPS-APLX5-A10-0432 Intel ATOM x5-E3940 - 4GB DDR4 + 32GB eMMC UPS-APLP4-A10-08128 Intel Pentium N4200 - 8GB DDR4 + 128GB eMMC. The "Android" name and the Android logo are property of Google Inc. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

10 Intel, the Intel logo, Intel Insider, Intel SpeedStep, and Atom are trademarks of Intel Corporation in the and/or other countries. All rights reserved. UP Bridge The Gap is Trademark of Aaeon Europe. All Rights reserved.


Related search queries