VERSAFLOW 3/45 - Kurtz Ersa

1 VERSAFLOW 3/45 Modular selective Platform for Highly Efficient & Flexible In-Line soldering selective SOLDERINGVERSAFLOWVERSAFLOW 3/45 Optimized Efficiency Combined With Highest FlexibilityVERSAFLOW 3/45 Dual track machine with dual fl ux, preheat and solder modulesModular & Compact Machine Platform Increases Productivity, Flexibility & Reduces CostsERSA, a world market leader for in-line selective sol-dering systems for the past decade, has successfully launched its third generation of selective machines in the premium segment, the VERSAFLOW 3 Series. Increased production effi ciency, increased throughput & fl exibility and reduced fl oor space requirements & running costs, make up just a few of the technology highlights of the VERSAFLOW VERSAFLOW 3/45 encompasses a new, modular machine platform which offers a signifi cant saving in fl oor space when compared to the previous VERSA-FLOW systems.

2 The basic version of an in-line selective solder sys-tem has three functional modules: a fl ux, a preheat and a solder module complemented by a segmented conveyor system. Yet, through its unrestricted system confi guration possibilities, the VERSAFLOW 3 can be custom trimmed to ideally suit the users requirements in regards to process and production throughput. 5. Fl PH S PH S PH S (ST)4. 2Fl PH 2S PH 2S (DT)3. Fl PH S PH S (ST)2. 2Fl PH 2S (ST)1. Fl PH S (ST)Near Zero Defect SolderingFor product groups, requiring highest reliability and quality level of the assemblies, manual soldering does not provide the measure of repeatability that is possible to achieve in the automated wave soldering process.

3 But with today s pres-sures to cut operating costs, conventional wave soldering is not a practical and viable alternative anymore. Production costs in conventional wave soldering are substantially higher than in the selective process. Due to the large amount of solder used, higher maintenance costs, and the increased amount of oxides (dross), charging a wave solder bath with solder costs many multiples of a selective system s bath fi lling, even more so when it is for the lead-free process. The short life expectancy of the solder in the bath due to copper contamination, higher costs for nitrogen and a higher defect and scrap rate are additional factors, which might call for the introduction of the selective in place of the conventional wave soldering process.

4 The VERSAFLOW selective solder-ing process advantages of Better, Faster, Cleaner & Cheap-er can translate not only into a tremendous increase in the soldering quality, but also into signifi cant costs savings!SINGLE & DUAL TRACKVERSAFLOW 3/45 Basic Machine Confi gurationThe VERSAFLOW selective solder nozzle and potThe revolutionary design of the ERSA VERSAFLOW selective solder nozzle and pot offer a level of solder joint process control never before dreamed of in a production soldering process. All dynamic and static functions such as solder level, wave height and solder temperature are continually monitored & traceable.

5 The maintenance-free, electromagnetically oper-ated solder delivery system ensures a constant solder fl ow rate with no moving parts. Exact wave height is precisely adjustable for repeatable results. VERSAFLOW guarantees perfect solder joint defi nition and reproducibility, as well as complete documentation of individual solder parameters. All of these unique features combine with the improved solder wave peel-off function to offer individually programmable process parameters per solder joint!MODULAR PLATFORMT able 1: Fl = Flux Module, PH = Preheat Module, S = Solder Module, ST = Single track transport, DT = Dual track transportThis table shows only some of the many possible confi Fl PH S PH S PH S (ST)4.

6 2Fl PH 2S PH 2S (DT)3. Fl PH S PH S (ST)2. 2Fl PH 2S (ST)1. Fl PH S (ST)Advantages of VERSAFLOW Technology:High fl exibility due to modular designSolder modules with single nozzles and/or multijet solder nozzle platesDual pot systems fort he use of different solder alloys or for processing multi-up panelsHighest solder joint quality and signifi cant reduction of DPM DPM approaching Zero DefectShorter cycle times than in manual/robotic solderingDual track conveyor for increased throughput (parallel processing in fl ux, preheat and solder module)High process safety, soldering at 0 ; PCB stationary during the soldering processOptimal capillary rise when processing heavy-mass multilayer boards via top-side convection heating in the solder moduleIncreased positioning accuracyIntuitive software with extensive process documentationCommunication with Manufacturing Execution Systems (EMS), process controls and trace data acquisitionGraphic based programming, therefore program gen-eration effi cient and Flux dots, 3 mm; 2.

7 Flux tracks, 3 mm ea.; 3. Flux track, 6 mmBottom-side short wavelength IR & top-side, convection heating technologyDual track fl uxingDual track preheatingDepending on the application at hand, multiple solder pots, fl uxers and/or preheaters can be integrated into the system. Some possible system confi gurations, from the smallest to the largest confi guration, are depicted in condensed form in table Fluxing Effi ciencyVERSAFLOW 3 machines integrate a programma-ble, precision micro drop fl uxing system for selective point or track fl uxing with automatic spray accuracy control. The fl ux head delivers an absolutely precise & defi ned amount of fl ux to the smallest of areas on the PCB.

8 The fl ux pattern on the joint can be either focused dots or tracks of fl ux as small as 3 mm! In this way, only the precise amount of fl ux required is utilized, thereby reducing fl ux waste and keeping ionic contamination to Preheating FlexibilityThe VERSAFLOW 3 combines three different heating technologies from both the top & bottom-side guaran-teeing the greatest preheat fl exibility. Bottom-side short wavelength IR, top-side convection heating technology as well as a new top side hybrid heating technology extends the process fl exibility for the preheating of high-mass energy effi cient bottom-side preheating cassettes are segmented; depending on the specifi c job require-ment; preheat confi guration or total length can be var-ied in order to ensure optimum effi ciency and maximum workfl ow fl absolute minimum.

9 For multi panel applications, up to 4 individually synchronized working spray heads can be installed per fl ux moduleSOLDERDrag and drop programming using DXF or picture dataDual track solderingHighest Efficiency In-Line soldering via Parallel Processing & Dual Track OptionThe VERSAFLOW 3/45 has the shortest cycle time due to the parallel processing on the individual mod-ules. Multiple fluxing heads or solder nozzles can be attached to the same axis system to increase the soldering with two different solder alloys on the system, two solder pots can be installed in one solder module. Similarly, two fluxers can be installed for two different flux formulations.

10 This configuration enables the user to process different boards requiring differ-ent alloys in batch size 1 without loss of time due to a change VERSAFLOW 3 also offers the very first dual track capability seen in an in-line selective machine. The greatest flexibility and the highest volume throughput can be achieved at a minimum of required floor space. Simultaneous processing in the machine of up to 22 PCBs is now possible. Up to six solder pots and four flux spray heads can run simultaneously in the machine offering the highest volume throughput in a league of its own. The entire transport is segmented for frameless production and guarantees the fastest product , the process visualization feature as well as the improved serviceability at the front & back side of the machine rounds off the added value of the new & Off- Line Programming and Machine SoftwareThe CAD Assistant software allows for simple and fast off-line programming and thereby ensures that the ma-chine stays in production while new programs are being generated.