Example: stock market

WL CSP 実装マニュアル - エプソン

WL-CSP ii Seiko Epson Corporation WL-CSP 1. 2. 3. 4. 5. 6. 7.

図1.4 WL-CSP断面概図 表1.2 【参考】 WL-CSPランド部のデザインルール注1 Unit: mm 名称 記号 0.4mmピッチ 0.5mmピッチ 0.65mmピッチ 銅ランド径 Cu1 Nom. 0.22 Nom. 0.27 Nom. 0.42 ランド開口径 Cu2 Nom. 0.20 Nom. 0.25 Nom. 0.40

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Advertisement

Transcription of WL CSP 実装マニュアル - エプソン

1 WL-CSP ii Seiko Epson Corporation WL-CSP 1. 2. 3. 4. 5. 6. 7.

2 8. HP 9. ESD EOS SEIKO EPSON CORPORATION 2018, All rights reserved. WL-CSP Seiko Epson Corporation iii 1 WL-CSP .. 5 WL-CSP .. 5 .. 5 WL-CSP .. 6 WL-CSP .. 7 2. WL-CSP .. 8 .. 8 .. 8 .. 9 .. 9 .. 9 3.. 10 .. 10 NSMD SMD .. 10 .. 11 .. 12 .. 12 4.. 13 .. 13 .. 14 .. 15 .. 15 .. 15 .. 15 .. 15 .. 16 5.

3 17 .. 17 .. 17 .. 17 6.. 18 .. 18 .. 18 .. 18 .. 18 .. 19 .. 20 7.. 21 WL-CSP .. 21 iv Seiko Epson Corporation WL-CSP .. 21 .. 21 .. 21 .. 21 .. 21 .. 21 8.. 22 9 .. 23 .. 23 .. 23 .. 23 .. 25 1 WL-CSP WL-CSP Seiko Epson Corporation 5 1 WL-CSP WL-CSP 1 Wafer Level Chip Size Package) 2 1 WCSP JEITA WL-CSP 2 WL-CSP WL-CSP WL-CSP IC IC Polyimide (Cu; Copper IC WL-CSP IC (Al.)

4 Aluminum) IC WL-CSP IC UBM (Under Bump Metal) IC IC 1 WL-CSP 6 Seiko Epson Corporation WL-CSP WL-CSP WL-CSP 1 Unit: mm WL-CSP 2 WL-CSP WL-CSP Cu2 WL-CSP 3 WL-CSP 4 Nom. Nom. Nom. Nom. Nom. Nom. Nom. Nom. 1 2 3 IC 4 WL-CSP WL-CSP WL-CSP 1 Unit: mm Cu1 Nom.

5 Nom. Nom. Cu2 Nom. Nom. Nom. 1 Cu1 Cu2 PCB Printed circuit board WL-CSP IC Cu2 Cu1 (Polyimide) (Copper) TiW/Cu 4 WL-CSP 2 3 IC 1 WL-CSP WL-CSP Seiko Epson Corporation 7 WL-CSP WL-CSP IC ( Si; Silicon) WL-CSP WL-CSP WL-CSP (1) (2) (3) IC (4) IC IC IC NG OK WL-CSP WL-CSP WL-CSP PCB (Rigid / Flexible) IC (Si Silicon) 2.

6 WL-CSP 8 Seiko Epson Corporation WL-CSP 2. WL-CSP WL-CSP SMD (Surface Mount Device) SMD SMT (Surface mount technology ) SMD 1 WL-CSP BGA(Ball Grid Array) 1 2.

7 WL-CSP WL-CSP Seiko Epson Corporation 9 1 WL-CSP Flip WL-CSP 1 [ ] [3 ] [ ] [ ] [ ] [ ] (2) SPI 3 [5 ] WL-CSP 4 [6 ] [ ] [ ] [ ] [ ] N2 5 [7 ] (6) (7) AVI (2),(6),(7) 3.

8 10 Seiko Epson Corporation WL-CSP 3. NSMD(Non Solder Mask Defined) SMD (Solder Mask Defined) 2 NSMD SMD NSMD SMD WL-CSP WL-CSP NSMD SMD NSMD SMD NSMD SMD NSMD SMD 1 NSMD SMD 2 NSMD SMD 1 2 WL-CSP WL-CSP 3.

9 WL-CSP Seiko Epson Corporation 11 NSMD WL-CSP 1 WL-CSP 1 Unit; mm Ball pitch WL-CSP PCB (Printed Circuit Board) NSMD SMD -40 C +125 C WL-CSP ,16pin,Pitch 1 WL-CSP vs (NSMD) 1 WL-CSP vs (NSMD) WL-CSP vs 3.

10 12 Seiko Epson Corporation WL-CSP OSP(Organic Solder-ability Preservatives) Ni/Au WL-CSP SMD 4. WL-CSP Seiko Epson Corporation 13 4. WL-CSP Sn - - WL-CSP ( )


Related search queries