www.juki.co

1 Specifications Model High-speed chip shooter High-speed chip shooter with MNVC High-speed flexible mounter KE-2050RM KE-2055RM KE-2060RM. KE-2050RL KE-2055RL KE-2060RL. Item KE-2050RE KE-2055RE KE-2060RE. size (330 250mm) . size (410 360mm) . Board size -wide (510 360mm) . size (510 460mm) 1 . 6mm . 12mm . Component height 20mm . 25mm 2 . 0603(0201) 20mm or 11mm 0603(0201) Laser recognition (0402(01005) optional) 10 (0402(01005) optional) 10. Component size 3 20mm 3 74mm Vision recognition . or 11mm or 50 150mm Chip 4 13,200 CPH 12,500 CPH 12,500 CPH.

2 Placement speed 1,850 CPH 4 5. IC 3,290 CPH 6. 3,400 CPH 6. Laser recognition Placement accuracy Vision recognition ( when using MNVC). Feeder inputs Max. 80 on 8mm T/F 7. Power supply 200 to 415 VAC, 3-phase Apparent power 3kVA High-speed Flexible SMT Placement System Operating air pressure Air consumption 230L/min 280L/min size 1,400 1,393 1,440mm Machine dimensions size 1,500 1,500 1,440mm (W D H 8) 9 -wide 1,730 1,500 1,440mm size 1,730 1,600 1,440mm Mass (approximately) 1,400kg 1,410kg 1 Production arrangement starts only after receipt of P/O for E size board.

3 Model High-speed modular mounter 2 Available only for E size board. Item FX-1R. 3 When using high resolution camera.(option). Board size size(410 360mm) 4 Effective tact: The chip placement speed indicates an estimated value obtained when the machine places 400 1005-chips all over a M size Component height 6mm . board. 0603(0201) 20mm The IC placement speed indicates an estimated value obtained when the Component size Laser recognition or 11mm machine places 36 QFP (100 pins or more) or BGA components (256. balls or more) all over a M size board.

4 (0402 (01005) optional) 10. (CPH number of components placed for one hour). 33,000 CPH(optimum condition) 5 The placement speed indicates an estimated value from the tray holder. Placement speed Chip 6 Estimated value when using MNVC (option for KE-2060R) and picking up 25,000 CPH(IPC9850). components simultaneous with all nozzles. Placement accuracy Laser recognition 7 In addition to matrix tray changer, max 110. 8 Display is not included in height. Feeder inputs Max. 80 on 8mm T/F. 9 Dimensions of machine described are for conveyor height 900mm.

5 Power supply 200 to 415 VAC, 3-phase 10 Please ask for details on 0402(01005) placement. Averaged value during pickup or placement 4kVA. Apparent power Please refer to the product specifications for details. Maximum value 12kVA. Operating air pressure Air consumption 400L/min Machine dimensions (W D H 8) 9 1,880 1,731 1,490mm Mass (approximately) 2,000kg Electronic Assembly & Test Systems Division 2-11-1, Tsurumaki, Tama-shi, Tokyo 206-8551, JAPAN. juki Specifications and appearance may be changed without notice.

6 This catalogue prints with environment-friendly soyink on recycle paper. Dec-2009/0000. 3E C o n ce pt + H i gh Qu al i ty Hig h e r pr o d u c t i vi ty. Hi g h er q u al i ty. juki 's original technology supports the high accuracy and high repeatability required for high density placement. 4 nozzles on-the-fly centering (MNLA: Multi-Nozzle Laser Align). Laser centering L aser c en terin g tec h n ology High accuracy, high-speed mounting High reliability 1) High-speed 4 nozzles on-the-fly centering 4 Centering errors prevented by self check A high resolution laser is mounted on the head to center components in Laser contamination is checked prior to the production.

7 If contamination all directions including angle. Centering is done on-the-fly, allowing high is detected, an alarm is given to prevent centering errors. speed placement of components from small chips to SOPs. Component orientation in laser First minimum width Second minimum width Shadow width High-speed Flexible SMT Placement System 0 90 . Simplified data entry R series is born. Adaptable centering 5 Ease-of-use improved by automatic component measurement 2) Centering accommodates component variations Component data can be completed entering just approximate dimensions, Laser centering measures the components on the side.

8 It is not affected by type and packaging information. The exact dimensions and lead variations of component color or width/length so, unlike vision centering, count/pitch are measured by the machine and automatically entered into 3E Modular Concept there is no need to edit component data for different component vendors. the component data. Component dimensions: Width Low loss ratio Flexible machine modules can be configured Depth 3) Component check function improves placement reliability Economical in a wide variety of lines to meet the exact Since the laser is mounted on the head, it can be used to monitor the production needs with minimal investment.

9 Height presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement. Simple software layout, graphical interface, Easy to use and intelligent mechanical design make the Modular Concept introduced machines easy to use and easy to maintain. by juki in 1993. Our products continuously evolve to meet the needs Machines can easily be added or removed from a line to suit changing production of the ever-changing SMT industry.

10 Expandable requirements. Re-balancing and optimization of production files takes just seconds. Presence of component is monitored Component release Tombstone pick easily detected. until just before placement. confirmed after placement. Component data is updated after automatic measurement. Fe at ures f or ma xi mum qu ali ty a nd m axim um pro ducti vi ty Featu res o f th e R s er i es N EW Features of the R series "Racing" - means enhancing the competitiveness at the mounting site R se r ies ca t e gor y High quality FCS Production volume, component type, cost and production (Flex Calibration System) style.