Advanced Packaging Current Trends & Challenges

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2020From Technologies to MarketsAdvanced Packaging Current Trends & Challenges9ADVANCED Packaging PLATFORMS Classification at System Integration LevelWafer levelSubstrate/Strip level (Panel based)Panel levelLevel 1 -DieInterconnectionSubstrate/ leadframeLevel 2 - Packaging ModuleLevel 3 -No SMT neededSiP/PoP, in PCB/FlexED in laminateOrganic/glass substrate organic substrateFlip-chipWire-bondRDLFIWLPFOWLP 3 glass bridgeBump/pillarTSV/ TGVCeramic/ leadframe and othersAdvanced organic substrateMold embeddingOrganic interposerFCWBCSPBGA StandardBGA AdvancedLGABGALGACSPOrganic substrateCeramic/ leadframe and othersFCWBAP platform10 2018 | | status of the Advanced Packaging industry 2018ADVANCED Packaging MARKET SHARE EVOLUTION 2014-2025Advanced Packaging revenue will almost equal to traditional Packaging revenue by 2019, the AP market share was Due to strong momentum in AP market driven by mega Trends .

©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018 10 ADVANCED PACKAGING MARKET SHARE EVOLUTION 2014-2025 Advanced Packaging revenue will almost equal to traditional packaging revenue by 2025. In 2019, the AP market share was 42.6%. Due to strong momentum in AP market driven by mega trends, the share of

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