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Status of the Advanced Packaging Industry 2020 July 2020 ...

2020 From Technologies to Markets 2020 Status of the Advanced Packaging Industry 2020 Market and Technology Report 2020 Sample22 GLOSSARIESAIA rtificial IntelligenceASICA pplication Specific Integrated CircuitARAugmented RealityBEBack-EndBGABall Grid ArrayCISCMOS ImageSensorCSPChip ScaledPackageCPUC entral Processing UnitDSPD igital Signal ProcessorDMSD esign Manufacturing ServicesDTVD igital TVEDE mbedded Die (in laminate substrate)EMSE lectronicsManufacturing ServicesFEFront-EndFIFan-In FCFlip ChipFOFan-OutFPGAF ield ProgrammableGate ArrayGPUG raphics ProcessingUnitHBMHigh Bandwidth MemoryHDHighDensity (Fan-Out) OR High Definition (TV)HPCHigh Performance ComputingHVMHighVolume ManufacturingI/OInput/OutputIDMI ntegrated Device ManufacturerICIntegrated CircuitIIoTIndustrial Internet of ThingsIoTInternet ofThingsL/SLine/SpaceLEDL ight Emitting DiodeM&AMerger & AcquisitionmSAPmodifiedSemi-Additive ProcessODMO riginal Design ManufacturerOEMO riginal Equipment ManufacturerOSATO utsourced Semiconductor Assembly and TestPCPersonal ComputerPCBP rinted Circuit BoardPCBAP rinted Circuit Board AssemblyPLPP anel Level PackagingPMICP ower ManagementICPWBP rinted Wiring BoardQFNQuad Flat No-Leads QFPQuad Flat PackageRDLR edistribution layerRFRadio FrequencySAPSemi-Additive ProcessSiMSystemin ModuleSiPSystemin PackageSMTS urface Mount TechnologySTBSet-Top BoxTSVT hrough Si ViaTXVRT ransceiverVRVirtual RealityWBWirebondWEWearablesWiFiWireless FidelityWLPW afer Level

The “Statusof the Advanced Packaging Industry”is a yearly overview report. The objectives of the report are as follows: Status of the Advanced Packaging Industry 2020 | …

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