Transcription of High-End Performance Packaging: 3D/2.5D Integration 2020
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High-End Performance Packaging: 3D/2.5D Integration 2020
From Technologies to Markets 2020 High-End Performance Packaging: 3 Integration 2020 Market and Technology ReportSample2 Tableofcontents2 Scopeofreport4 Reportmethodologies&definitions6 Keyfeaturesofthisreport5 Abouttheauthor7 YoleGroupofcompaniesrelatedreports9 Glossaries11 Companiescitedinthisreport12 3-Pagesummary13 Executivesummary17 Context66oSemiconductorindustry playerspursuingMoore slaw67oHigh-endperformancepackagingdefin ition71oScopeofreport72oHigh-endperforma ncepackagingmarketsegment73oHigh-endperf ormancepackagingintroduction74 Marketforecasts75oMarketRevenue76oTotalm arketrevenueoSplitbyend-marketoSplitbyte chnologyoMarketUnits80oTotalmarketunitso Splitbyend-marketoSplitbytechnologyHigh- end Performance Packaging: 3 Integration 2020 | Sample | | 2020 TABLE OF CONTENTSPart 1 Markettrends96oCloud&edgecomputing97oClo udcomputingandnetworking103oHigh-Perform anceComputing(HPC)111oArtificialintellig enceforautonomousvehicles119oChapterconc lusion125 Commercializedproductsanditssupplychain1 27oProductlaunches130o3 Dstackedmemorieso(x)PUoGPUforHPCoSupplyc hainforhigh-endperformancepackaging156oG lobalmappingofhigh-endpackagingoGlobalma ppingbasedontechnologyoSupplychainforhig h-endpackagingproductsoLatestprogressofk
o 3D Stacking (3DS) DRAM o 3D SRAM o 3D NAND o Others: HMC, DRAM stacked memory o 2.5D interposer 284 ... • To update the business status of high-end performance packaging technology markets ... 2002-2003 2004-2006 2006-2008 2008-2012 2010-2012 2012-2014 2014-2016 2017-2019 2020-2022 2023-2025 s Technology Node [Moore’s Law*] Year ADI AMD ...
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