Chapter 4. Basic Failure Modes and Mechanisms - NASA
89Chapter 4. Basic Failure Modes and MechanismsS. KayaliFailures of electronic devices, in general, can be catastrophic or failures render the device totally nonfunctional, while noncatastrophicfailures result in an electrically operating device that shows parametric degradation andlimited Chapter provides a description of some of the more common Failure modesand Mechanisms affecting GaAs-based MMICs. The current understanding of the topicwill be presented along with a discussion of some possible solutions, practiced processimprovements, and Failure ModesGaAs devices exhibit some general Failure Modes that can be attributed to adefined Failure mechanism. The most common Failure Modes are observed viadegradation of the MMIC parameters such as IDSS, gain, POUT, and others. Thedegradation observed in MMIC devices is normally a function of the material interactionsand the environmental conditions during test or operation.
temperatures (< 100°C) but it also indicates rapid deterioration at elevated temperatures (>150°C) [9]. The general understanding of ohmic contacts attributes the degradation to the following : (1) Ga outdiffusion into the Au layer, which creates a nonstochiometric defect-rich region of high resistivity under the contact. This effect is
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