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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS

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CHAPTER 6THERMAL DESIGN CONSIDERATIONSpageIntroduction6 - 2Thermal resistance6 - 2Junction temperature6 - 2Factors affecting Rth(j-a)6 - 2Thermal resistance test methods6 - 3Test procedure6 - 3Forced air factors for THERMAL resistance6 - 4Thermal resistance data - assumptions and precautions6 - 5Thermal resistance (Rth(j-a)) data6 - 6Thermal resistance (Rth(j-c)) data tables - power packages6 - 24April 20006 - 2Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial.

Thermal design considerations Chapter 6 Lead Frame Design The design of a lead frame is another significant contributing factor to thermal resistance. The most important design aspect is the IC attach-pad size and tie bar design. However, the lead frame designer is often faced with fixed parameters such as die size and wire bonding limitations ...

  Design, Chapter, Considerations, Design considerations, Design considerations chapter

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