CHAPTER 6 THERMAL DESIGN CONSIDERATIONS
CHAPTER 6THERMAL DESIGN CONSIDERATIONSpageIntroduction6 - 2Thermal resistance6 - 2Junction temperature6 - 2Factors affecting Rth(j-a)6 - 2Thermal resistance test methods6 - 3Test procedure6 - 3Forced air factors for THERMAL resistance6 - 4Thermal resistance data - assumptions and precautions6 - 5Thermal resistance (Rth(j-a)) data6 - 6Thermal resistance (Rth(j-c)) data tables - power packages6 - 24April 20006 - 2Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial.
Thermal design considerations Chapter 6 Lead Frame Design The design of a lead frame is another significant contributing factor to thermal resistance. The most important design aspect is the IC attach-pad size and tie bar design. However, the lead frame designer is often faced with fixed parameters such as die size and wire bonding limitations ...
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