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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS

CHAPTER 6 THERMAL DESIGN CONSIDERATIONS pageIntroduction6 - 2 THERMAL resistance6 - 2 Junction temperature6 - 2 Factors affecting Rth(j-a)6 - 2 THERMAL resistance test methods6 - 3 Test procedure6 - 3 Forced air factors for THERMAL resistance6 - 4 THERMAL resistance data - assumptions and precautions6 - 5 THERMAL resistance (Rth(j-a)) data6 - 6 THERMAL resistance (Rth(j-c)) data tables - power packages6 - 24 April 20006 - 2 Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6 INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial.

Thermal design considerations Chapter 6 Lead Frame Design The design of a lead frame is another significant contributing factor to thermal resistance. The most important design aspect is the IC attach-pad size and tie bar design. However, the lead frame designer is often faced with fixed parameters such as die size and wire bonding limitations ...

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