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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS

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CHAPTER 6THERMAL DESIGN CONSIDERATIONSpageIntroduction6 - 2Thermal resistance6 - 2Junction temperature6 - 2Factors affecting Rth(j-a)6 - 2Thermal resistance test methods6 - 3Test procedure6 - 3Forced air factors for THERMAL resistance6 - 4Thermal resistance data - assumptions and precautions6 - 5Thermal resistance (Rth(j-a)) data6 - 6Thermal resistance (Rth(j-c)) data tables - power packages6 - 24April 20006 - 2Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial.

Also, the thermal performance of packages for a specific application may be different than presented here because the configuration of the application boards may be different than the test boards. Philip Semiconductors uses low effective thermal conductivity test boards for most of its packages. 2. Device standoff is a factor in determining thermal

  Performance, Thermal, Thermal performance

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