Transcription of CHAPTER 6 THERMAL DESIGN CONSIDERATIONS
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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS
CHAPTER 6 THERMAL DESIGN CONSIDERATIONS pageIntroduction6 - 2 THERMAL resistance6 - 2 Junction temperature6 - 2 Factors affecting Rth(j-a)6 - 2 THERMAL resistance test methods6 - 3 Test procedure6 - 3 Forced air factors for THERMAL resistance6 - 4 THERMAL resistance data - assumptions and precautions6 - 5 THERMAL resistance (Rth(j-a)) data6 - 6 THERMAL resistance (Rth(j-c)) data tables - power packages6 - 24 April 20006 - 2 Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6 INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial.
Also, the thermal performance of packages for a specific application may be different than presented here because the configuration of the application boards may be different than the test boards. Philip Semiconductors uses low effective thermal conductivity test boards for most of its packages. 2. Device standoff is a factor in determining thermal
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