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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS

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CHAPTER 6THERMAL DESIGN CONSIDERATIONSpageIntroduction6 - 2Thermal resistance6 - 2Junction temperature6 - 2Factors affecting Rth(j-a)6 - 2Thermal resistance test methods6 - 3Test procedure6 - 3Forced air factors for THERMAL resistance6 - 4Thermal resistance data - assumptions and precautions6 - 5Thermal resistance (Rth(j-a)) data6 - 6Thermal resistance (Rth(j-c)) data tables - power packages6 - 24April 20006 - 2Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial. With increased powerdensities, improved reliability and shrinking system sizes,the cooling of IC packages has become a challenging taskfor DESIGN engineers.

3. The operating environment temperature must be used as the ambient temperature when calculating junction temperatures in an application. The temperatures inside an electronic enclosure are generally higher than the room temperature. 4. Whenusingairflowderatingcurves(seeFig.5),please note that in actual applications where airflow is

  Temperatures, Room, Room temperature

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