Transcription of CHAPTER 6 THERMAL DESIGN CONSIDERATIONS
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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS pageIntroduction6 - 2 THERMAL resistance6 - 2 Junction temperature6 - 2 Factors affecting Rth(j-a)6 - 2 THERMAL resistance test methods6 - 3 Test procedure6 - 3 Forced air factors for THERMAL resistance6 - 4 THERMAL resistance data - assumptions and precautions6 - 5 THERMAL resistance (Rth(j-a)) data6 - 6 THERMAL resistance (Rth(j-c)) data tables - power packages6 - 24 April 20006 - 2 Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6 INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial. With increased powerdensities, improved reliability and shrinking system sizes,the cooling of IC packages has become a challenging taskfor DESIGN engineers.
3. The operating environment temperature must be used as the ambient temperature when calculating junction temperatures in an application. The temperatures inside an electronic enclosure are generally higher than the room temperature. 4. Whenusingairflowderatingcurves(seeFig.5),please note that in actual applications where airflow is
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