Design Summary Multi-rowQuad Flat No …
ApplicationReportSZZA059 August2012DesignSummaryMulti-rowQuadFlat No-lead(MRQFN).......................... ........................................ ........................................ ........................................ ...ABSTRACTTexasInstrumentsIncorporated( TI)introducestheMulti-rowQuadFlatNo-lead (MRQFN) ,withoutperipherallyprotrudingleads, , :100Pin(MRQFN)PackageMRQFNPackageDetails (1)100Pin(MRQFN)TotalNumberofPins100Pack age*Length(L)mm9Package*Width(W)mm9Packa geThickness(T) , (JEDEC)MSL3 / 260C(1)NominalDimensionsShown(SeePackage Drawingforfullinformation)1SZZA059 August2012DesignSummaryMulti-rowQuadFlat No-lead(MRQFN)SubmitDocumentationFeedbac kCopyright 2012,TexasInstrumentsIncorporatedPCB LAND PAD DETAIL A Note: The PCB land pattern illustrated is specificallydesigned by part number therefore, variations inthermal pad dimensions may exist betweenpart numbers. The exposed pad sizes can beconfirmed within the product data , contact your TI customerrepresentative for further ,05 TYP0,050,400,600,250,05 TYP0,05 TYP0,05 TYP0,05 TYP0,05 TYPEXAMPLE NON-SOLDERMASK OPENING (NOTE F)0,30 ,25 TYP0,600,407,308,807,308,800,25 TYP0,600,400,600,550,550,60SEE NOTE8,508,500,30 SQDETAIL "A" (NonSolderMaskDefined)padsoverSMD(Solder MaskDefined)padswhensurfacemountingMRQFN s (MRQFN)SZZA059 August2012SubmitDocumentationFeedbackCop yright 2012, StencilDesignNotes(A)Alldimensionsarein millimeters.
www.ti.com THERMAL CHARACTERISTICS JEDEC 2S2P (1) 100-RKM Die Size 5000µm x 5000µm Theta-JA(deg C/W) 21.6 (1) Thermal values are modeled results. Model simulated a JEDEC test board (JEDEC51-5)utilizing a dual sided metal 10 x 10
Download Design Summary Multi-rowQuad Flat No …
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: