ELECTRONICS INDUSTRIES Monotonic Bend …
IPC/JEDEC-9702Monotonic BendCharacterizationof board -LevelInterconnectsDeveloped by the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product Reliability Committee (6-10) of IPC and theJEDEC Reliability Test Methods for Packaged Devices Committee( )Users of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135Tel 847 847 State Technology Association2500 Wilson BoulevardArlington, VA 22201-3834Tel 703 703 CONNECTINGELECTRONICS INDUSTRIES Table of 14TERMS AND 15SYMBOLS AND ABBREVIATED Tester ........................................ ............... Measurement Equipment .............................. Monitoring Equipment .......................... Sample ........................................ ......... board Material ........................................ ......... board Thickness and Metal Layer Count.
Monotonic Bend Characterization of Board-Level Interconnects 1 FOREWORD This publication on monotonic bend testing is intended to characterize the fracture strength of a component’s board-
Download ELECTRONICS INDUSTRIES Monotonic Bend …
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
ForStressandStrain, Introduction, D. SHARP TECHNICAL DOCUMENTARY, D. sharp technical documentary report no, Characterization of Board Level Interconnects, Strain, Tank Weighing Woes, Strain Gages, Introduction to Strain Gages, Plane-Shear Measurement with Strain Gages, Silver Soldering Technique or Attachment o, To Strain Gages Strain