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ELECTRONICS INDUSTRIES Monotonic Bend …

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IPC/JEDEC-9702Monotonic BendCharacterizationof board -LevelInterconnectsDeveloped by the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product Reliability Committee (6-10) of IPC and theJEDEC Reliability Test Methods for Packaged Devices Committee( )Users of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135Tel 847 847 State Technology Association2500 Wilson BoulevardArlington, VA 22201-3834Tel 703 703 CONNECTINGELECTRONICS INDUSTRIES Table of 14TERMS AND 15SYMBOLS AND ABBREVIATED Tester ........................................ ............... Measurement Equipment .............................. Monitoring Equipment .......................... Sample ........................................ ......... board Material ........................................ ......... board Thickness and Metal Layer Count.

Monotonic Bend Characterization of Board-Level Interconnects 1 FOREWORD This publication on monotonic bend testing is intended to characterize the fracture strength of a component’s board-

  Levels, Board, Characterization, Interconnect, Monotonic, Bend, Monotonic bend characterization of board level interconnects

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