Search results with tag "Soldering"
UDA1334ATS Low power audio DAC with PLL - NXP
www.nxp.com17 SOLDERING 17.1 Introduction to soldering surface mount packages 17.2 Reflow soldering 17.3 Wave soldering 17.4 Manual soldering 17.5 Suitability of surface mount IC packages for wave and reflow soldering methods 18 DATA SHEET STATUS 19 DISCLAIMERS
Guidelines for Temperature Profiling for Mass Soldering ...
www.ipc.orgpertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave). 1.2 Background During mass soldering, it is important that all solder joints reach the minimum soldering tempera-ture. The minimum soldering temperature is the minimum temperature necessary to assure metallurgical bonding of
Package Information : SOP8
fscdn.rohm.comSOP8 Package Information 7. Soldering conditions 7.1 Recommended temperature profile for reflow 7.2 Recommended condition for wave soldering Preheating temperature : 120 °C to 150 °C Preheating time : 60 sec MAX Soldering temperature : 260 °C ± 3 °C Soldering time : …
PROPERTIES OF SOLDERS
www.farnell.complace during soldering. The breakage time of 0.067mm copper wire in various solders as a function of temperature is shown below . Savbit solder has been used by leading electronics manufacturers throughout the world for over forty years. Savbit was originally used to increase the life of copper soldering iron bits. Soldering speed
PROFILE SUPPLEMENT FOR WAVE SOLDERING PROCESS
aimsolder.comLead-Free Alloys 260 ... This defect information addresses common issues related to the wave soldering process. Soldering defects can be caused by a myriad of other process/material variables. However, there are three main inputs to forming a high quality solder joint and
Surface Mount Multilayer Ceramic Chip Capacitors for ...
www.vishay.com(1) “R” = Reflow soldering process; “W” = Wave soldering process DIMENSIONS in inches (millimeters) SIZE CODE THICKNESS SYMBOL SOLDERING METHOD (1) LW T MB 0402 (1005) NR 0.040 ± 0.002 (1.00 ± 0.05) 0.020 ± 0.002 (0.50 ± 0.05) 0.020 ± 0.002 (0.50 ± 0.05) 0.010 + 0.002 / - 0.004 (0.25 + 0.05 / - 0.10) ER0.040 ± 0.008 (1.00 ± 0.20 ...
SOT23 - NXP
www.nxp.comThermal design considerations SC18_1999_CHAPTER_5_2 Mounting method type S (surface mount) Generic mounting and soldering information AN10365_3 Reflow soldering footprint SOT023_fr Wave soldering footprint SOT023_fw Package life cycle status REL Major version date 18-9-2008 Minor version date 6-7-2012 Security status COMPANY PUBLIC Modified ...
ELEMENTS OF MECHANICAL ENGINEERING - vtu.ac.in
vtu.ac.inIntroduction to basics of Hydraulic turbines and pumps: JBOS 18.10.2021 / EC 30.10.2021 Page 2 of 5 Principle and Operation of Hydraulic turbines, namely, Pelton Wheel, Francis Turbine and ... Soldering, Brazing and Welding: Definitions. Classification and methods of soldering,
PCB Washing and Coilcraft Parts
www.coilcraft.comor make recommendations regarding cleaning systems. Coilcraft tests for resistance to solvents per the following specification. Resistance to solvents specification: MIL-STD-202 Method 215 plus an additional aqueous wash. Further reference Selecting Flux for Soldering Coilcraft Components Soldering Surface Mount Component Kester, Inc. (www ...
STLINK-V3MODS and STLINK-V3MINI debugger/programmer …
www.st.com2. Apply the recommended reflow soldering profile, from . Soldering recommendations and package information for Lead-free ECOPACK microcontrollers (AN2639), and verify that contacts between host board and module meet the IPC Specification (see IPC-A-610-F Acceptability of El ectronic Assemblies). 3.
INTRODUCTION TO HAND SOLDERING - eLabtronics
www.elabtronics.com• 12 x ¼ watt resistors • 10 cm of 0.7 – 0.9 mm tinned copper wire for staples • 80 cm of 0.71 mm 60 / 40 multi core solder • 5 cm of 2.0 – 2.5 mm desoldering wick • 3 cm piece of lollipop stick • ledfun kit (to be kept in a resealable bag labelled with student name) Tools One set between 2 students in a pencil case (16 sets)
313/ 315 Series Lead-Free 3AG, Slo-Blo Fuse Pb PS E
www.littelfuse.comSoldering Parameters - Wave Soldering Dwell Time 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 0 10 20 30 40 50 60 70 80 90 10 0 11 0 12 0 13 0 14 0 15 0 16 0 17 0 18 0 19 0 20 0 21 0 22 0 23 0 24 0 Time (Seconds) Temperature (°C) - Measured on bottom side of boar d Preheat Time Cooling Time Wave Parameter Lead-Free Recommendation
Thermostatic Expansion Valves - - Parker
sporlanonline.comtype valves when soldering to the connecting lines. Any of the commonly used types of solders, e.g., 95-5, Sil-Fos, Easy-Flo, Phos-Copper, Stay Brite 8 or equivalents may be used for copper to copper connections. When soldering a brass refrigerant distributor to the valve, appropriate solders for these connections,
Lead (Pb)-free Thick Film, Rectangular Commodity Chip ...
www.vishay.comLead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors FEATURES • High volume product suitable for commercial ... REFLOW SOLDERING WAVE SOLDERING INCH METRIC L W H T1 T2 a b l a b l 0402 1005 1.0 ± 0.10 0.5 ± 0.05 0.30 ± 0.05 0.25 ± 0.10 0.2 ± 0.1 0.4 0.6 0.5
1111C Series - Stanley Electronic Components
www.stanley-components.comOperating Temperature. Lead–free soldering compatible. RoHS compliant. Green: 558nm(BG),567nm(PG) Yellow Green: 572nm(PY) Yellow: 590nm(AY) Orange: 606nm(AA) Red ... When the second reflow soldering process is performed, intervals between the first . and second reflow should be short as possible (while allowing some time for the ...
SMB - Diodes Incorporated
www.diodes.comSurface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.096 grams (Approximate) Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020 Package View Package Outline Dimensions SMB SMB
SMA - Diodes Incorporated
www.diodes.comSurface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.064 grams (Approximate) Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020 Package View Package Outline Dimensions SMA
MOUNTING AND HANDLING GUIDELINES FOR …
aosmd.comthe time-temperature specification of the package is not exceeded in the soldering operation. References 1. Sanjay Havanur, Application Note: AN101-1 , June, 2007 This document contains preliminary data; supplementary data may be published at a later date. Alpha and Omega Semiconductor reserves the right to make changes at any time without notice.
Low Cost, DC to 500 MHz, 92 dB Logarithmic Amplifier Data ...
www.analog.comThe AD8307 is the first logarithmic amplifier made available in an 8-lead SOIC_N package. It is a complete 500 MHz monolithic ... The AD8307 is extremely stable and easy to use, requiring no significant external components. A single-supply voltage of ... (Soldering, 10 sec) 300°C
1N5820 and 1N5822 are Preferred Devices Axial Lead Rectifiers
www.onsemi.com•Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ... 1N5822G Axial Lead (Pb-Free) 500 Units/Bag 1N5822RL Axial Lead 1500/Tape & Reel 1N5822RLG Axial Lead (Pb-Free) ... Circuit Half Wave Full Wave, Bridge Full Wave, Center Tapped* ...
QRE1113, QRE1113GR, QRE1114GR Miniature Reflective …
www.onsemi.com1. Refer to application note AND8003/D, “Storage and Handling of Dry Packed Surface Mounted Devices” for details of handling procedure. 2. Product soldering terminals are silver plated and oxidization may occur with prolonged exposure to ambient environment. Oxidized terminal may have poor solderability performance.
Environmental Health & Safety Procedure Manual
dept.harpercollege.edu19.6 BRAZING, SOLDERING, CASTING AND SMITHING _____ 191 19.7 STAINED GLASS _____ 193 ... be published in the Environmental Health and Safety Procedure Manual. B. General Information The manual contains programs …
Package dimensions MSOP, SSOP, TSSOP-A2 - iC-Haus
www.ichaus.deFor additional information on component handling, preconditioning and soldering conditions, refer to the relevant iC-Haus customer information files, available separately. iC-Haus Application Guide More Package Info. Title: Package dimensions MSOP, SSOP, TSSOP-A2.indd Created Date: 8/4/2006 1:07:11 PM ...
Optocoupler, Phototransistor Output, High Reliability ...
www.vishay.comRefer to wave profile for soldering conditi ons for through hole devices (DIP). Note • Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements.
Introducing the C4FM/FM and Repeater System
caraham.org• Large-size Heat-Sink & Cooling Fan to en sure stable Power Output and increased operating time • Emergency Power Operation: Supports Em ergency Battery up to 55 Amp Hour / Trickle Charger Included • 15 Pin Rear accessory connector for Standard Analog connectivity. (COR/COS, Audio IN/OUT, ... No soldering, cable ...
SM712 Series 600W Asymmetrical TVS Diode Array RoHS …
m.littelfuse.comSoldering Parameters Power Derating Curve 0 10 20 30 40 50 60 70 80 90 100 110 02 55 07 51 00 1251 50 Ambient Temperature - TA(oC) % of Ra ted Po we r I PP Non-Repetitive Peak Pulse Power vs. Pulse Time Pulse Duration - tp(µs) P eak Pu ls e Po we r - …
OUTPUT VOUT OUTPUT - Diodes Incorporated
www.diodes.comLead-Free 1A LOW DROPOUT LINEAR REGULATOR Description The AZ1117 is a series of low dropout three-terminal regulators with a dropout of 1.15V at 1A output current. The AZ1117 series provides current limiting and thermal shutdown. ... Lead Temperature (Soldering, 10sec) T LEAD
Fast, Voltage-Out, DC to 440 MHz, 95 dB Logarithmic ...
www.analog.comSpecifications subject to change without notice. No ... General Matching Procedure ... Lead Temperature (Soldering 60 sec) 300°C . Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
a Dual Operational Amplifier High-Speed, Low-Power AD826
www.analog.comLead Temperature Range (Soldering 10 seconds) . . . +300°C. NOTES. 1. Stresses above those listed under Absolute Maximum Ratings may cause perma-nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is ...
SP4020 Series 2.5pF, 30A Discrete TVS Diode RoHS GREEN
www.littelfuse.comSoldering Parameters Product Characteristics Lead Plating Matte Tin Lead Material Alloy 42 Lead Coplanarity 0.0004 inches (0.102mm) Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (T s(min)) 150°C ...
219 Series 2021-3-12 - CTS Corp
www.ctscorp.comSoldering Maximum reflow temperature, 25 0°C for 30 seconds MSL Level 1 RoHS Lead -Free. Fully compliant to RoHS Directive 2011/65/EU Shock Per MIL -STD -202F, method 213B, condition A( 50G’s) with no contact inconsistencies greater than 1 microsecond Vibration Per MIL -STD -202F, method 204D, condition B ( .06” or 15G’s between 10 HZ to ...
MURS120T3G Series, SURS8120T3G Series, NRVUS120VT3G …
www.onsemi.com• Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ... SQUARE WAVE (CAPACITANCELOAD) IPK IAV 20 10 5.0 i. MURS120T3G Series, SURS8120T3G Series, NRVUS120VT3G Series www.onsemi.com 4 MURS140T3G, MURS160T3G, SURS8140T3G, SURS8160T3G, NRVUS160VT3G
The Smith Generator - Easy DIY Power Plan
easydiypowerplan.comare easy to follow. Change the regular light bulbs with LED or Fluorescent light bulbs will lower the energy consumed for light as much as 12 times. Using the ... Soldering iron will be used to solder the circuit. The circuit will still operate if the connections aren’t soldered,
Building Circuits on Breadboards - Electronics Club
electronicsclub.infotesting or to try out an idea. No soldering is required so it is easy to change connections and replace components. Parts will not be damaged so they will be available to re-use afterwards. The photograph shows a circuit on a typical small breadboard which is suitable for beginners building simple circuits with one or two ICs (chips).
Surface Mount Fuses - Littelfuse
www.littelfuse.comSoldering Parameters Time e mperatur e T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone T L to T P Part Numbering System Example: 1.5 amp Fast-acting product is 015401.5DR. 1.5 amp Time-lag product is 015401.5DRT. (1 amp product shown above). 0154 001. D R T L Series AMP ...
TPL910A, 1-A Output, High-PSRR, Low-Noise Low-Dropout ...
3peakic.com.cnLead Temperature (Soldering 10 sec) 260 °C (1) Stresses beyond the Absolute Maximum Ratings may permanently damage the device. (2) All voltage values are with respect to GND. ESD, Electrostatic Discharge Protection Symbol Parameter Condition Minimum Level Unit HBM Human Body Model ESD ANSI/ESDA/JEDEC JS-001(1) ±4000 V
ADC080x 8-Bit, µP-Compatible, Analog-to-Digital Converters ...
www.ti.comLead Temperature Dual-In-Line Package (ceramic) 300 (Soldering, 10 seconds) Surface Mount Package Vapor Phase (60 seconds) 215 °C Infrared (15 seconds) 220 Storage Temperature –65 150 Package Dissipation at TA = 25°C 875 mW (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are ...
Harley Davidson Wiring Made Easy - Siebenthaler Creative
siebenthalercreative.comon any printer, easy enough for anyone to follow, and provides enough wiring basics for just about any project. AMP Connectors The toughtest thing about wiring an AMP socket is pin spacing, especially with larger sockets. The pin numbering’s next to invis-ible, soldering’s difficult, and you’ve got to make sure the numbers match - 1 to 1, 2
DCC Wiring – A Practical Guide. - 4dpnr.com
4dpnr.comDCC Wiring Basics III Learn to solder well. You can make many under baseboard connections with solder-less splices, but still need to solder to the rails at least. The five basics for electrical soldering: Clean all surfaces (fresh wire surfaces, no oxide on track, no track weathering…) Clean again If any doubt clean again!
PROFILE SUPPLEMENT FOR LEAD-free ALLOYS
aimsolder.comDocument Rev # 4 Page 5 of 6 TERMS AND DEFINITIONS Alloy, Tin Silver Copper (Sn-Ag-Cu): An alloy that is used as a lead-free solder consisting of tin, silver and copper as the main constituents.* Alloy, Tin Nickel Copper (Sn-Ni-Cu): An alloy that is used as a lead-free solder consisting of tin and copper considered to be applicable for wave or reflow soldering.
GENERAL DESCRIPTION
datasheets.kyocera-avx.comGENERAL DESCRIPTION ... BOARD BEND TEST PROCEDURE According to AEC-Q200 BOARD BEND TEST RESULTS ... Soldering Reflow/Wave Reflow/Wave Reflow/Wave WVDC 25V 50V 25V 50V 25V 50V 271 Cap 270 G G 331 (pF) 330 G G J J 471 470 G G J J 681 680 G G J J 102 1000 G G J J J J
FlameWheel 450 - dl.djicdn.com
dl.djicdn.comSoldering-iron & wires For connecting ESCspower ’ cables to bottom board. The screw size is M3. Mount the motors using appropriate screws. Note the thread depth and the size of the screws. Using screws that are too long or too large may damage the motor. 19 mm 16 mm 28.2 mm 40 mm 26 mm M6 4×M3 Thread depth 3mm
BC327, BC327-16, BC327-25, BC327-40 Amplifier Transistors
www.onsemi.comdownload the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BCxxx= Device Code A = Assembly Location Y = Year WW = Work Week = Pb−Free Package MARKING DIAGRAM ... BC327−40ZL1G 7−40 TO−92 Bent Lead (Pb−Free) 2000 / Tape & Ammo Box
Axial-Lead Glass Passivated Standard
www.onsemi.com*For additional information on our Pb−Free strategy and soldering details, please ... 1N4001G Axial Lead* (Pb−Free) 1000 Units/Bag 1N4001RL Axial Lead* 5000/Tape & Reel 1N4001RLG Axial Lead* ... the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of ...
1N4001, 1N4002, 1N4003, 1N4004, 1N4005, 1N4006, 1N4007 ...
www.farnell.com*For additional information on our Pb−Free strategy and soldering details, please ... 1N4001G Axial Lead* (Pb−Free) 1000 Units/Bag 1N4001FF Axial Lead* 3000 Units/Box 1N4001FFG Axial Lead* (Pb−Free) ... SCILLC products are not designed, intended, or authorized for use as components in systems intended for ...
Laboratory Risk Assessment Tool - Stanford University
ehs.stanford.eduFeb 06, 2021 · ☐ Soldering ☐ Lithium batteries ☐ Pressure or vacuum vessels . Ergonomic Hazards ... Identify the general safety and procedure based/specific training appropriate for your procedure. General Safety . General Safety ☒ General Safety & Emergency Preparedness (EHS-4200) ☐ Laboratory Ergonomics (EHS-4800)
Soldering is Easy: Here's How to Do it (Extended Version)
mightyohm.comTouch the cleaned tip to both the pad and the lead of the part you want to solder. Keep it there for about 1 second, so everything heats up nicely. Then add about 1mm to 3mm of solder under the tip. Don’t add it above the tip, since that melts the solder
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