Search results with tag "Solder"
Edition 1.0 2018-04 TECHNICAL SPECIFICATION
webstore.iec.chfrom tin-lead to -Pbfree, and a majority of BGA components manufacturers have converted from tin-lead solder balls to Pbfree solder balls. This has introduced well documented - reliability concerns. In the case of a leaded soldering process, a solution can be to replace the Pb-free solder balls on the BGA components with tinlead solder balls.
This document provides guidance for manufacturers and ...
nepp.nasa.govLCC solder joints . Maximum side pad overhang: 25% . No stand-off height (solder thickness) is defined though wetting shall be evident. Gull wing lead solder joint . Solder may extend into the top lead bend area. Solder may come in contact with the package body or end seal for plastic SOIC or SOT packages.
PROFILE SUPPLEMENT FOR LEAD-free ALLOYS - AIM Solder
aimsolder.comVoiding Wicking solder ... Head-in-Pillow (Hip): Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully coalesce with the BGA sphere. The resulting solder joint forms enough of a connection to have electrical continuity, but lacks mechanical strength. ...
DCC Wiring – A Practical Guide.
4dpnr.comsplices, but still need to solder to the rails at least. The five basics for electrical soldering: Clean all surfaces (fresh wire surfaces, no oxide on track, no track weathering…) Clean again If any doubt clean again! Apply heat and a little rosin cored solder wire. When the initial solder runs, apply some more and stop.
AN2265 - Assembly Guidelines for Land Grid Array (LGA ...
www.nxp.comSolder paste grain size can be useful to manipulate by pitch. For larger pitch parts, 0.80 mm and larger, Type 3 solder powder (25 to 45 micron grain size) is widely used. At the pitches, 0.65 mm and smaller, Type 4 solder (20 to 38 microns grain size) may provide a better solder joint.
Reference Only - Murata Manufacturing
www.murata.com95% covered with new solder coating. Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s 7-3.Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method
SENJU METAL INDUSTRY CO.,LTD. SMIC LEAD FREE SOLDER
www.senju.comSolder Solder Ni-Cu compound (sherbet form) Oxide Entrained solder Additive of elements which reduces amount of oxide Sn generation 3%Ag 0%Ag M705RK M20RK Prevent Erosion & Contami. of Iron Tip M705 M710/M714/M715 M731 M758 M794 M34/M771 M40 M35 M47 Hi-Melting Point Spec. NEW NEW Sn-Cu-Ni M24AP LD Flow/Flux Cored Std. Clumped dross …
Status and Outlooks of Flip Chip Technology
www.circuitinsight.comtechnology [2] utilizes high-lead solder bumps deposited on wettable metal terminals on the chip and a matching footprint of solder wettable terminals on the substrate. The solder-bumped flip chip is aligned to the substrate, and all solder joints …
HIGH-DENSITY OPEN-PIN-FIELD ARRAYS - Samtec
suddendocs.samtec.comsolder tail –S = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on solder tail –04 –05 –06 –08 –10 SEAM: -04, -05 & -06 (Rows not available with -06.5 Lead Style) –1 = Tin/Lead Alloy Solder Charge –2 = Lead-Free Solder Charge –A = Alignment Pin –K Polyimide Film Pick & Place Pad –TR = Tape & Reel –FR = Full Reel Tape ...
3-Axis Digital Compass IC HMC5883L - Adafruit Industries
cdn-shop.adafruit.comHMC5883L, which is compatible with lead eutectic and lead-free solder paste reflow profiles. Honeywell recommends adherence to solder paste manufacturer’s guidelines. Hand soldering is not recommended. Built-in self test can be used to verify device functionalities after assembly. External Capacitors
Alloy Temperature Chart - Kester
www.kester.comCommonly specified solder alloys are shown in the table. The selection of alloy is determined by application, melting temperature and physical properties. The alloys listed may be available in forms other than those indicated. Other solder alloys are also available. Kester Solder Alloys
SOT23 - NXP
www.nxp.comsolder lands solder resist occupied area solder paste s ot0 23 _f r 0.5 (3×) 0.6 (3×) 0.6 (3×) 0.7 (3×) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm ... customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
°C
belfuse.comSolder Reflow Due to “lead free / RoHS 2 ” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ” zone of the reflow profile are greater than those used for non-RoHS devices. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. Not Recommended For Wave Solder / Direct Immersion. 3.
SB 50 Connectors
www.andersonpower.comWire Plating Silver PCB Plating Sn or Ag over Ni Contact Termination Methods Crimp ³ Wire Contacts Hand Solder Wire and PCB Contacts Solder Dip PCB Contacts Wave Solder PCB Contacts Wrench / Socket Busbar Contacts SB® 50 NOTE 1: See IEC 60664-1 for working voltage. NOTE 2: Amp ratings are stated per position and based on all positions being ...
PROFILE SUPPLEMENT FOR WAVE SOLDERING PROCESS
aimsolder.comFlux quantity recommendations on Technical Data Sheets are often a broad range due to the wide variety of variables in a wave solder process. To obtain optimal soldering results, it may be necessary to adjust the amount of flux applied to the PCB. This is accomplished by adjusting the flow rate and/or the traverse speed of the flux head.
Accelerated Thermal Cycling and Failure Mechanisms For …
nepp.nasa.gove.g. space and defense, the ability to inspect the solder joints visually has been standard and has been a key factor in providing confidence in solder joint reliability. Inspection techniques such as X-ray can be used to detect gross manufacturing defects such as solder bridging, but are not suitable for detection of other defects such as cracks.
Thick Film Chip Resistors, Military / Established ...
www.vishay.comTermination Solder-coated nickel barrier Solder finish Tin / lead solder alloy STANDARD ELECTRICAL SPECIFICATIONS VISHAY DALE MODEL MIL-PRF-55342 STYLE MIL SPEC. SHEET TERM. CASE SIZE POWER RATING P70 °C W MAX. WORKING VOLTAGE (1) V RESISTANCE RANGE Ω TOLERANCE ± % TEMPERATURE COEFFICIENT (2) ± ppm/°C …
Bulletin 110 January 2022 - Reliable Sprinkler
www.reliablesprinkler.comstandard spray automatic sprinklers using a solder capsule thermal element. The solder is captured in the cylinder of the capsule by a stainless steel ball. When the solder melts, the ball ... A leak tight sprinkler joint can be obtained with a torque of 8 to 18 lb-ft (11 - 24 N.m) for
What are the Different Types of Battery Connectors and Lugs?
www.powerandsignal.comsolder method ¬ Especially good in presence of destructive vibration or corrosive chemicals ¬ Faster, less confusing and less costly than multi-component solder slug programs ¬ Fasteners included ¬ Kits are available B A Gauge Stud Hole Solder and flux precisely metered Barrel chamfered for easier cable entry Relative Pull-Out Strength ...
Notice Concerning Acquisition of Assets of Solder ...
pdf.kabutan.jpDec 21, 2021 · solder materials that offer high reliability and excellent durability even in harsh environments. We have already responded to this demand by developing and launching "high durability lead-free solder paste" to meet the needs of our customers.s In the telecommunications industry,
Dr. Jennie Hwang to address “Preventing Manufacturing ...
www.semiconductorpackagingnews.comJan 14, 2022 · • In Japanese, "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Industrial Research, Japan 1990; • (ISBN-0442-2075-49) "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1988,
MSI Z390 Overclocking Guide – Push Core i9-9900K Over …
download.msi.comSolder TIM for 9th Gen processors Intel 9th Gen processors include i9-9900K, i7-9700K and i5-9600K. All of them are overclockable. And compared to 8 th gen processors, the 9 gen processors use Solder Thermal Interface Material (STIM) instead of 8th gen processors’ thermal paste. It’s expectable that the 9th Gen
PROPERTIES OF SOLDERS
www.farnell.comMulticore 96S alloy is the pure tin/silver eutectic alloy; like pure tin, it is bright, hardly tarnishes, is lead-free and non-toxic, but unlike pure tin it is relatively strong. It has higher electrical conductivity than other soft solders and a melting point approximately 40°C
Electric Tankless Water heaters
images.thdstatic.com1. Do not solder any pipes with the unit connected to pipes – heat from soldering may damage the flow sensor. Doing so will void the warranty. 2. This automatic tankless water heater is equipped with both computer-controlled and electro-mechanical auto resetting thermostat switches for high-limited temperature protection. Since this
Tow-Pro Wiring Kit - Ford Ranger / Everest
www.redarc.com.auSolder the wires to the Butt Splice. Ensure that a good connection is made. Wait for the Butt Splice to cool, slip the Heatshrink over the joint and heat. Reconnect the 16-way connector (1). Keep heatshrink away from joint until after soldering is complete and cooled. Proceed to Step 30. Page 13 of 3 12 34
MSL Ratings and Reflow Profiles (Rev. A) - TI.com
www.ti.com• Liquidous temperature (TL) for lead-free soldering - this is approximately 217°C. This varies according to the used solder alloy. • The Peak temperature (Tp) for the reflow profile, measured at top of the package. – For the user (board assembly process), Tp must not exceed Tc as shown in Table 2. For the IC
11mm Size Metal Shaft Type EC11 Compact and ... - Farnell
www.farnell.comthe solder land black part: Do not solder and wiring for electrical contact 11.3 5-ø1.05holes D E B C A 6 7 EC11K Vertical EC11G EC11G with push-on switch （travel 1.5mm） EC11G with push-on switch （travel 1.5mm） EC11K Vertical with push-on switch （travel 0.5mm / 1.5mm） 4.45 ø5.975 Mounting surface ø8.975 4.54.5 1.9 1.6 EC11K15 ...
Metal Film Resistors, Axial, Military/Established ...
www.vishay.com(3) Hot solder dipped leads. (4) Tolerance of ± 0.1 % is not applicable to characteristics K. STANDARD ELECTRICAL SPECIFICATIONS GLOBAL MODEL MIL-PRF-55182 STYLE MIL SPEC. SHEET POWER RATING P70 °C W POWER RATING P125 °C W TOLERANCE (4) ± % MAXIMUM WORKING VOLTAGE (2) V RESISTANCE RANGE Ω TEMPERATURE …
Base Materials for High Speed, High Frequency PC Boards ...
www.qsl.net- Must attempt to permit Proper Solder Reflow. • Ground: All Designs, 2 Layer or Multilayer – - Unused Areas of Every Layer to be Poured with Ground Copper. - Ground Copper and All Ground Planes through Board to be Connected with Vias Every 1/20th - Wavelength Apart (Where Possible). - Vias Closer than 1/20th λ are Better.
LTM8073 – 60VIN, 3A Silent Switcher µModule Regulator
www.analog.comPeak Solder Reflow (Package Body) Temperature .. 250°C PART NUMBER TERMINAL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE DEVICE FINISH CODE (Note 3) LTM8073EY#PBF SAC305 (RoHS) LTM8073 e1 BGA 3 –40°C to 125°C LTM8073IY#PBF • Consult Marketing for parts specified with wider operating temperature …
BM83 Bluetooth® Stereo Audio Module DS
ww1.microchip.com• AN233 Solder Reflow Recommendation Application Note (DS00233) Notes: ...
DuPont Kapton® HN
www.dupont.comSolder Float pass IPC-TM-650 Method 2.4.13A Smoke Generation D m =<1 NBS smoke chamber NFPA-258 Shrinkage, % 30 min at 150°C 120 min at 400°C 0.17 1.25 IPC-TM-650 Method 2.2.4A; ASTM D-5214-91 Limiting Oxygen Index, % 37–45 ASTM D-2863-87 Glass Transition Temperature (Tg)
This catalog covers Amphenol - Farnell
www.farnell.comproducts is the Amphenol ... Contacts are available in both solder and crimp versions. Pins and sockets are machined from copper alloy with a silver plated finish. Size 16 and 12 socket contacts incor-porate a closed entry design. Refer to pages 49, …
Qualification and Performance Specification of Permanent ...
www.ipc.orgQualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials 1 SCOPE AND DESIGNATION 1.1 Scope Thisspecificationshall ...
鉛フリーはんだを用いた製品に対する信頼性試験に関する研 …
www.pref.yamanashi.jpStudy on Reliability Test for PCB Using Lead-free Solder Alloy （2nd Report） Akio SHIMIZU, Hironaga MIYAMOTO, Hiroyuki HIRAKAWA and Daisuke SUZUKI 要 約 鉛フリーはんだの接続信頼性を検証するために，昨年度は鉛フリーはんだとしては代表的な組成のSn-3.0Ag-
Quadruple 2-Input Positive-AND Gates datasheet
www.ti.com- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device ...
SS - Omron
omronfs.omron.comSolder terminals 0.49 N {50 gf} SS-10GL02-T SS-5GL02-T SS-01GL02-T Quick-connect terminals (#110) SS-10GL02T-T SS-5GL02T-T SS-01GL02T-T PCB terminals SS-10GL02D-T SS-5GL02D-T SS-01GL02D-T Ratings 10.1 A 5 A 0.1 A Actuator Terminals Contact Form Maximum Operating Force (OF) Long hinge lever ...
FC-PBGA, Flip Chip Plastic Ball Grid Array (FC-PBGA)
www.nxp.com3.Non-symmetrical joint fails at the package interface first in thermal cycling 1.Potential stress point 2.Foreign matter entrapment on pad 3.Possible worse dimensional tolerance on ... Hot Air Solder Leveled (HASL), electroless or electrolytic nickel/gold (NiAu) and immersion silver (Ag)
HIGH-DENSITY OPEN-PIN-FIELD ARRAYS
suddendocs.samtec.comIPC J-STD-001F Class 3 solder joint. Board Mates: SEAF, SEAFP Standoffs: JSO Board Mates: SEAM, SEAMP, SEAR, SEAMI Standoffs: JSO MATED HEIGHTS SEAM LEAD STYLE SEAF LEAD STYLE –05.0 –06.0 –06.5 –07.5 –02.0 7 mm 8 mm 8.5 mm 9.5 mm –03.0 8 mm 9 mm 9.5 mm 10.5 mm –03.5 8.5 mm 9.5 mm 10 mm 11 mm –06.5 11.5 mm 12.5 mm 13 mm 14 mm
Soldering is Easy: Here's How to Do it (Extended Version)
mightyohm.comsolder and make electrical connections. The best solder for electronics has rosin core and is 60% tin, 40% lead. n It gets There are other types, for instance lead-free solder, but it has toxic chemicals in its core, and it is not quite as easy to use as solder with lead. It also corrodes soldering iron tips quickly. If you can only get lead-free
Solder Alloy Melting Temperature - Technic
www.technic.comSolder Alloy Melting Temperature METAL WEIGHT PERCENT MELTING TEMPERATURE SOLIDUS LIQUIDUS TIN LEAD SILVER OTHER DEGREES C DEGREES F 0 100 327 621 2 98 316-322 601-611 5 95 301-314 574-597 10 90 268-302 514 …
Solderability Tests for Printed Boards - IPC
www.ipc.orgTable 4-3 Lead-Free Reflow Parameter Requirements ... 15 Table 4-4 Pass/Fail Criteria for Specific Surface Finishes Using Eutectic SnPb ..... 17 Table 4-5 Pass/Fail Criteria for Specific Surface Finishes Using SAC305 Solder ..... 18 Table …
Mark 8 Series - Emerson Electric
www.emerson.com*SentronicD Proportional Valves, CGT Compact Slides, NR Series Rodless and Air Bellows are limited to orders up to 5. **A Series Large Bore NFPA, ASP Series Steel Body NFPA and G Series Guide Rail Rodless are limited to orders up to 5. Numatics Express Shipping Program guarantees† product shipment in two, three or five business days. Unlike most
コガネイ製品ガイド - wincofp.com
www.wincofp.comslit type rodless cylinders slit type rodless cylinders (with cam follower guides) slit type rodless cylinders ors series slit type rodless cylinders orw series マグネット式ロッドレスシリンダ magnet type flat rodless cylinders magnet type rodless cylinders mrs series magnet type rodless cylinders mrw series magnet type rodless ...
450 & 453 Series - Emerson Electric
www.emerson.com*SentronicD Proportional Valves, CGT Compact Slides, NR Series Rodless and Air Bellows are limited to orders up to 5. **A Series Large Bore NFPA, ASP Series Steel Body NFPA and G Series Guide Rail Rodless are limited to orders up to 5. Numatics Express Shipping Program guarantees † product shipment in two, three or five business days. Unlike most
Energy Saving Speed Controller/
ca01.smcworld.comRodless Cylinders Mechanical Joint Type MY1/2/3*4 10 M5 16 M5 AS1201F-M5E-04A 20 M5 25 Rc1/8 AS2201F-01-06SA*4 32 Rc1/8 40 Rc1/4 AS2201F-02-08SA 50 Rc3/8 AS3201F-03-10SA 63 Rc3/8 80 Rc1/2 AS4201F-04-12SA*4 100 Rc1/2 Type Series Bore size *5 [mm] Port size Speed controller Model Air Gripper Parallel Opening Square MHZ2*6 6 M3 AS1211F-M3-04*6
Chapter 7 - The pneumatic cylinder - part 1
www.hafner-pneumatik.como Rodless cylinders o Diaphragm cylinders o Rotary cylinders Movement o Linear o Rotary = turning Function o Single-acting o Double-acting o 3- or 4-positions Cushioning o Adjustable, pneumatic cushioning o Flexible cushioning o Without cushioning There is a very wide variety of pneumatic cylinders.
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