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BM83 Bluetooth® Stereo Audio Module DS
ww1.microchip.com• AN233 Solder Reflow Recommendation Application Note (DS00233) Notes: ...
AN233 Solder Reflow Recommendation - Microchip …
ww1.microchip.comPb-free solder such as Tin-Silver-Copper (Sn-Ag-Cu) ... Figure 4 shows Microchips’s recommended profiles for standard devices with 63%/37% tin-lead (Sn-Pb) solder finish. The reflow profile for these devices can be any-where between the upper and lower curves shown in Figure 4. Please note that the peak temperature is