Transcription of AN233 Solder Reflow Recommendation - Microchip …
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AN233 Solder Reflow Recommendation - Microchip …
2004 Microchip Technology 1AN233 INTRODUCTIONThe electronic manufacturing industry is movingtowards lead- free , environmentally safe assemblyprocesses. Factors that should be considered whenswitching to lead- free soldering materials include: circuit board thickness fabrication complexity surface finish assembly process compatibilityThis Application Note focuses on Solder reflowrecommendation for packages with Matte Tin and Tin/Lead OF THE Reflow PROCESSLead- free soldering techniques have been available forsome years. However, they do not always meet thesame physical criteria for attachments as alloyscontaining lead. In the past, the most common alloy forjoining electronic components was the mixture of 63%tin and 37% lead. This composition of tin and leadprovided excellent bonding strength as well as enoughelasticity to withstand the thermal stresses in theproduct s operating environment.
Pb-free solder such as Tin-Silver-Copper (Sn-Ag-Cu) ... Figure 4 shows Microchips’s recommended profiles for standard devices with 63%/37% tin-lead (Sn-Pb) solder finish. The reflow profile for these devices can be any-where between the upper and lower curves shown in Figure 4. Please note that the peak temperature is
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