Transcription of Optimizing Reflow Profiling in Lead-free SMT Assembly
{{id}} {{{paragraph}}}
Example: dental hygienist
Optimizing Reflow Profiling in Lead-free SMT Assembly
Optimizing Reflow Profiling in Lead-free SMT Assembly Edward Briggs Indium Corporation Outline Reflow phases Max slope vs. ramp rate Factors affecting Reflow process window Solder defects Conclusion Indium Corporation Reflow Phases Preheat Reflow Minimize thermal shock Intermetallic formation Drive off volatiles Peak Ramp rate TAL. Pre- Reflow Cooling Flux activation/oxide Grain structure removal Minimize CTE. Void minimization Indium Corporation Preheat Ramp Rate Max (+) Slope C/s Ambient to peak 4min 40s (280s). C/s x 280s =. C increase from ambient to peak 25 C (ambient). + C =. C peak Indium Corporation Preheat Ramp Rate True ramp rate or slope is from ambient to peak (RTP profile).
Reflow Phases • Preheat – Minimize thermal shock – Drive off volatiles – Ramp rate • Pre-reflow – Flux activation/oxide removal – Void minimization
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
Intrusive Reflow of Lead-free Solder, Reflow, Lead, Free solder, Free, Solder, AN233 Solder Reflow Recommendation, BEST PRACTICES REFLOW PROFILING FOR LEAD, INVESTIGATION AND DEVELOPMENT OF TIN, Lead Free Solder Reflow, Soldering, Lead free solder, LEAD-FREE HAND SOLDERING: NEW TECHNOLOGIES FOR, Lead-Free Selective Soldering: The Wave, Lead-free Soldering Materials and Processes