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Accelerated Thermal Cycling and Failure Mechanisms For

nepp.nasa.gov

e.g. space and defense, the ability to inspect the solder joints visually has been standard and has been a key factor in providing confidence in solder joint reliability. Inspection techniques such as X-ray can be used to detect gross manufacturing defects such as solder bridging, but are not suitable for detection of other defects such as cracks.

  Thermal, Reliability, Failure, Joint, Mechanisms, Accelerated, Cycling, Solder, Accelerated thermal cycling and failure mechanisms for, Solder joint reliability

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