Search results with tag "Solder joint"
Miniature Signal Relays EC2/EE2
content.kemet.comEE2-5(1)NUX-L 5.0 Surface mount, High solder joint reliability Tape on Reel EE2-12(1)NUX-L 12.0 Surface mount, High solder joint reliability Tape on Reel EE2-24(1)NUX-L 24.0 Surface mount, High solder joint reliability Tape on Reel EE2-3NKX1 3.0 Surface mount, High breakdown voltage, High solder joint reliability Tube
This document provides guidance for manufacturers and ...
nepp.nasa.govLCC solder joints . Maximum side pad overhang: 25% . No stand-off height (solder thickness) is defined though wetting shall be evident. Gull wing lead solder joint . Solder may extend into the top lead bend area. Solder may come in contact with the package body or end seal for plastic SOIC or SOT packages.
PROFILE SUPPLEMENT FOR LEAD-free ALLOYS - AIM Solder
aimsolder.comVoiding Wicking solder ... Head-in-Pillow (Hip): Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully coalesce with the BGA sphere. The resulting solder joint forms enough of a connection to have electrical continuity, but lacks mechanical strength. ...
Through Hole Solder Joint Evaluation
www.ipctraining.org1 Through Hole Solder Joint Evaluation Training and Reference Guide Solder Destination Side Barrel ... and the equipment must function when required. These high-reliability type prod-ucts are used in such systems as life-support and aerospace. ... Condition Levels Land Coverage Excess Solder Vertical Fill Wetting, Lead & Barrel Wetting of Lead ...
MSL Ratings and Reflow Profiles (Rev. A) - TI.com
www.ti.comsolder paste is starting its activity and cleaning process of all surfaces involved into the later solder joint begins. • Liquidous temperature (TL) for lead-free soldering - this is approximately 217°C. ... Wave soldering is an older technology that is frequently used for soldering through-hole components or the larger pitch packages, such ...
KOKI S3X58-M406-3 Lead Free Solder Paste - ADTOOL
www.adtool.caAnti-Pillow Defect Lead Free Solder Paste S3X48-M406-3 PREVENTS the occurrence of HIDDEN PILLOW DEFECT and ensures the quality of solder joints. Ensures OUTSTANDING continual PRINTABILITY with super fine pitch and CSP applications and has long stencil idle time. Heat RESISTANT new flux formula achieves complete solder melting and wetting on micro-components …
Accelerated Thermal Cycling and Failure Mechanisms For …
nepp.nasa.govsolder (63Sn/37Pb). At reflow, package side eutectic solder and the PWB side eutectic paste were reflowed to provide the electro-mechanical interconnects. The CBGA package had internal daisy chains which made a closed loop with daisy chains on the PWB, enabling the monitoring of solder joint failure through continuous electrical monitoring.
AN10778 PCB layout guidelines for NXP MCUs in BGA …
www.nxp.comSolder joint reliability is also of primary concern. For cost sensitive applications, minimizing the number of PCB layers required to route the BGA is a consideration. The BGA land pattern footprint plays a key role in solder joint reliability, and …
Inspection and testing methods for ... - Caltronics Design
caltronicsdesign.comhave trouble reading all the solder joints involved. Also, new chip packages like ball grid arrays (BGAs) have connections underneath the package, making them invisible to AOI systems. X-ray inspection systems provide a solution since they can see through a chip package to the solder underneath. They can also inspect
600WOG/150WSP Full Port Two-piece Brass Ball …
www.hasmak.com.trFig. Fig. SZA : BS21 thread AKSZA : NPT thread CSZA : Solder joint Tagging hole size L d H L d H S1 Tagging hole size through 2 ／ 12” ／ 12”
Review of the Impact of Intermetallic Layers on the ...
extra.ivf.se6-03-15 IVF Project Report 06/07 Review of the Impact of Intermetallic Layers on the Brittleness of Tin-Lead and Lead-Free Solder Joints Per-Erik Tegehall, Ph.D.
Design and Process Guidelines for Use of Ceramic Chip ...
www.ieca-inc.comVoiding • Voids bridging two or more electrodes can become a short leakage current path and a latent electrical defect • Large voids can also lead to a ... – Smaller solder joint fillets _____ CALCE Electronic Products and Systems Center University of Maryland ...
DEMO ONLY Version - IPC
www.ipctraining.org4 5 Terminology Below are definitions that may be helpful in describing surface mount solder joints (also see: IPC-T-50): Adhesive – In surface mounting, a glue used to adhere surface mount components to the printed wiring board.
Photos DEMO ONLY Version - Electronics Assembly …
training.ipc.org2 Class 1 Class 2 Class 3 3 Classification Surface mount solder joint requirements are divided into three classes depending on the ultimate use, life …
LGA1150 Socket — Application Guide - Intel
www.intel.comhaving a uniform load on the socket solder joints. Socket loading specifications are listed in LGA1150 Socket and ILM Specifications on page 24. Figure 1. LGA1150 Pick and Place Cover Board Layout The land pattern for the LGA1150 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections.
HIGH-DENSITY OPEN-PIN-FIELD ARRAYS
suddendocs.samtec.comIPC J-STD-001F Class 3 solder joint. Board Mates: SEAF, SEAFP Standoffs: JSO Board Mates: SEAM, SEAMP, SEAR, SEAMI Standoffs: JSO MATED HEIGHTS SEAM LEAD STYLE SEAF LEAD STYLE –05.0 –06.0 –06.5 –07.5 –02.0 7 mm 8 mm 8.5 mm 9.5 mm –03.0 8 mm 9 mm 9.5 mm 10.5 mm –03.5 8.5 mm 9.5 mm 10 mm 11 mm –06.5 11.5 mm 12.5 mm 13 mm 14 mm
SOLDERING PROCEDURE SPECIFICATIONS
www.copper.orgconditions used to produce an acceptable test solder joint and the results of the tests performed on the solder joint to qualify the solderer For information regarding CDA’s soldering procedures, contact a CDA regional manager through Copper Development Association Inc., 260 Madison Avenue, New York, NY 10016, or phone (212) 251-7200.
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Solder joint, Solder joints, Solder, Voiding, Reliability, Levels, MSL Ratings and Reflow Profiles, Through, Hole, M406-3 Lead Free Solder Paste, Accelerated Thermal Cycling and Failure Mechanisms For, AN10778 PCB layout guidelines for NXP MCUs, Design, Package, 600WOG/150WSP Full Port Two-piece, The Impact of Intermetallic Layers, The Impact of Intermetallic Layers on the Brittleness, Design and Process Guidelines for Use, DEMO ONLY Version, Photos DEMO ONLY Version, LGA1150 Socket — Application Guide, Intel