Transcription of LGA1150 Socket — Application Guide - Intel
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LGA1150 Socket — Application Guide - Intel
LGA1150 SocketApplication GuideSeptember 2013 Order No.: 328999-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH Intel PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OROTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN Intel 'S TERMS ANDCONDITIONS OF SALE FOR SUCH PRODUCTS, Intel ASSUMES NO LIABILITY WHATSOEVER AND Intel DISCLAIMS ANY EXPRESS OR IMPLIEDWARRANTY, RELATING TO SALE AND/OR USE OF Intel PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR APARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY "Mission Critical Application " is any Application in which failure of the Intel Product could result, directly or indirectly, in personal injury or YOU PURCHASE OR USE Intel 'S PRODUCTS FOR ANY SUCH MISSION CRITICAL Application , YOU SHALL INDEMNIFY AND HOLD Intel ANDITS SUBSIDIARIES.
having a uniform load on the socket solder joints. Socket loading specifications are listed in LGA1150 Socket and ILM Specifications on page 24. Figure 1. LGA1150 Pick and Place Cover Board Layout The land pattern for the LGA1150 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections.
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