Search results with tag "Land grid array"
AN2265 - Assembly Guidelines for Land Grid Array (LGA ...
www.nxp.comThe Land Grid Array (LGA) is a molded area array matrix package wh ich can be used in a socket or connected to the board using s older paste. The LGA package is identical in constr uction to the MAPBGA (Mold Array Process Ba ll Grid Array) or overmolded BGA (e.g. PBGA), except the BGA spheres are not attached.
Ball Grid Array (BGA) Packaging
www.intel.coman Organic Land Grid Array (OLGA) substrate. In addition to the typical advantages of PBGA pack-ages, the FC-style H-PBGA provides multiple, low-inductance connections from chip to package, as well as, die size and cost benefits. By providing …
FOR IMMEDIATE RELEASE Press Release
www.semiconductorpackagingnews.compackage on package, and land grid array applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and an environment where process speed and
Land Grid Array (LGA) Socket and Package Technology
www.intel.comLand Grid Array (no pins, exposed land pads), gold pads • Notched substrate for orientation control • Shipping Media: Thermoformed trays • Land Side Cover (LSC) to protect LGA package land pads from scratches and contamination when handled with vacuum wand or by hand. LGA Package in Thermoformed Tray. Land Side Cover. Avoid touching. gold ...