PDF4PRO ⚡AMP

Modern search engine that looking for books and documents around the web

Example: quiz answers

Ball Grid Array (BGA) Packaging

2000 Packaging Databook 14-1 Ball grid Array (BGA) plastic ball grid Array (PBGA) has become one of the most popular Packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the solder balls are self-centering (up to 50% off the pad), thus reducing placement problems during surface mount. Normally, because of the larger ball pitch (typically mm) of a BGA over a QFP or PQFP, the overall package and board assembly yields can be better. From a performance perspective, the thermal and electrical characteristics can be better than that of conventional QFPs or PQFPs.

an Organic Land Grid Array (OLGA) substrate. In addition to the typical advantages of PBGA pack-ages, the FC-style H-PBGA provides multiple, low-inductance connections from chip to package, as well as, die size and cost benefits. By providing …

Loading..

Tags:

  Land grid array, Land, Grid, Array, Grid array

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Spam in document Broken preview Other abuse

Transcription of Ball Grid Array (BGA) Packaging

Related search queries