Transcription of DEMO ONLY Version - IPC
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PhotosChip ComponentsJ-Lead ComponentsGull Wing ComponentsClass 3 Class 2 Class 1 IPC 2010 3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015-1219 +1 (tel.) +1 (fax) email: rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduc-tions of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United Rev. E 3m Rev. D 4m Rev. D 5m Rev. C 3m Rev. B 3m Rev. A 5m 1st printing 5m Association Connecting Electronics IndustriesDEMO only VersionThis is a promotional sample of the IPC Training and Reference Guide do not use this SAMPLE for training or reference is a not-for-profit association for the electronics industry.
4 5 Terminology Below are definitions that may be helpful in describing surface mount solder joints (also see: IPC-T-50): Adhesive – In surface mounting, a glue used to adhere surface mount components to the printed wiring board.
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M406-3 Lead Free Solder Paste, Solder, Solder Joints, Package design and solder joints board, Joints, The Impact of Intermetallic Layers, The Impact of Intermetallic Layers on the Brittleness, And Pry of BGA Solder Joints, SOLDER PASTE TRAINING, SOLDER JOINTS Solder, HAND SOLDERING TRAINING COURSE, Through Hole Solder Joint Evaluation, IPC-SM-785