AN10441 Level shifting techniques in I2C-bus design

Document information AN10441 Level shifting techniques in I2C-bus design Rev. 01 — 18 June 2007 Application note Info Content Keywords I2C-bus, level shifting Abstract Logic level shifting may be required when interfacing legacy devices with

  Notes, Applications, Levels, Technique, Shifting, Application note, An10441 level shifting techniques in, An10441

AN3234: Washing Machine Three-Phase AC …

Washing Machine Three-Phase AC Induction Motor Drive, Rev. 0 Indirect Vector Control 4 Freescale Semiconductor If you are looking for more theory on the field ...

  Machine, Washing, Washing machine

1. General description - nxp.com

1. General description The TJA1044 is part of the Mantis family of high-speed CAN transceivers. It provides an interface between a Controller Area Network (CAN) protocol controller and the physical

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PCA9570 Remote 4-bit general purpose outputs for 1 MHz …

1. General description The PCA9570 is a CMOS device that provides 4 bits of General Purpose parallel Output (GPO) expansion in low voltage processor and handheld battery powered mobile

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P82B96 Dual bidirectional bus buffer - nxp.com

1. General description The P82B96 is a bipolar IC that creates a non-latching, bidirectional, logic interface between the normal I2C-bus and a range of other bus configurations.It can interface

S32K144 EVB Quick Start Guide - NXP Semiconductors

J14 SWD connector. 3 EXTERNAL USE S32K144 EVBFeatures: ... USB connector of the USB cable to micro-B port J7 on the S32K144EVB. ... Windows, Linux and Mac operating systems. Using the MSD Flash Programmer 1. Locate the .srec file of your project , file is under the

Three-Phase BLDC Motor Sensorless Control Using …

This document describes the design of a three-phase brushless DC motor (BLDC motor) drive based on Freescale’s MC56F8013 and MC56F8023 dedicated motor control device. Brushless DC motors are popular in a wide application area.

  Phases, Using, Control, Motor, Three, Sensorless, Brushless, Brushless dc, Three phase brushless dc, Motor sensorless control using

AN11443 BFU550XR ISM 433 MHz LNA design - nxp.com

AN11443 BFU550XR ISM 433 MHz LNA design Rev. 1 — 23 January 2014 Application note . Document information Info Content Keywords BFU520, BFU530, BFU550 series, ISM-band, 433MHz 866MHz Abstract This document describes an ISM Frequency LNA design on BFU5xxXR Starter kit

  433 mhz, 433mhz

DSP56156 16-Bit Digital Signal Processor - nxp.com

The DSP56156 is a general-purpose MPU-style Digital Signal Processor (DSP). On a single semi- conductor chip, the DSP56156 comprises a very efficient 16-bit digital signal processing core, pro-

  Processor, Processing, Signal, Digital, Digital signal processing, Digital signal processor

SAA7706H Car radio Digital Signal Processor (DSP)

Car radio Digital Signal Processor (DSP) SAA7706H This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

  Processor, Radio, Signal, Digital, Car radio digital signal processor

Miniature Signal Relays EC2/EE2

EE2-5(1)NUX-L 5.0 Surface mount, High solder joint reliability Tape on Reel EE2-12(1)NUX-L 12.0 Surface mount, High solder joint reliability Tape on Reel EE2-24(1)NUX-L 24.0 Surface mount, High solder joint reliability Tape on Reel EE2-3NKX1 3.0 Surface mount, High breakdown voltage, High solder joint reliability Tube

  Joint, Solder, Solder joint

Through Hole Solder Joint Evaluation

Through Hole solder joint evaluation, and therefore, it references portions of the fol-lowing IPC standard: The IPC-A-610 Rev. F, Acceptability of Electronic Assemblies, which illustrates the requirements for many types of solder connections. Classification Through Hole solder joint requirements are divided into three classes depending

  Joint, Through, Hole, Solder, Through hole solder joint

Accelerated Thermal Cycling and Failure Mechanisms For …

solder (63Sn/37Pb). At reflow, package side eutectic solder and the PWB side eutectic paste were reflowed to provide the electro-mechanical interconnects. The CBGA package had internal daisy chains which made a closed loop with daisy chains on the PWB, enabling the monitoring of solder joint failure through continuous electrical monitoring.

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HIGH-DENSITY OPEN-PIN-FIELD ARRAYS

IPC J-STD-001F Class 3 solder joint. Board Mates: SEAF, SEAFP Standoffs: JSO Board Mates: SEAM, SEAMP, SEAR, SEAMI Standoffs: JSO MATED HEIGHTS SEAM LEAD STYLE SEAF LEAD STYLE –05.0 –06.0 –06.5 –07.5 –02.0 7 mm 8 mm 8.5 mm 9.5 mm –03.0 8 mm 9 mm 9.5 mm 10.5 mm –03.5 8.5 mm 9.5 mm 10 mm 11 mm –06.5 11.5 mm 12.5 mm 13 mm 14 mm

  Joint, Solder, Solder joint

SOLDERING PROCEDURE SPECIFICATIONS

conditions used to produce an acceptable test solder joint and the results of the tests performed on the solder joint to qualify the solderer For information regarding CDA’s soldering procedures, contact a CDA regional manager through Copper Development Association Inc., 260 Madison Avenue, New York, NY 10016, or phone (212) 251-7200.

  Joint, Solder, Solder joint

HANDBOOK ON WELDING TECHNIQUES - Indian Railways

This joint is made on thin metals using solder as a joining medium. The melting point of solder is less than the metals to be joined. The joint can be opened by heating upto the solder melting temperature (below 400°C). (ii) Brazing The joint is similar to soldering but has more strength. The joining medium used

  Joint, Solder

Difference Between Various Sn/Ag/Cu Solder Compositions

Joint strength (kgf) 0.0 1.0 2.0 3.0 4.0 5.0 0 1000 2000 3000 4000 Cycle Joint strength (kgf) 0.0 1.0 2.0 3.0 4.0 5.0 0 1000 2000 3000 4000 Cycle Joint strength (kgf) 3.1 Shear Testing Speed: 12mm / min Environment: 25 C number of tests = 5 Initial / 1000 cycles: Break at component side (solder itself is intact) 3000 cycles: Break at component ...

  Joint, Solder

FC-PBGA, Flip Chip Plastic Ball Grid Array (FC-PBGA)

3.Non-symmetrical joint fails at the package interface first in thermal cycling 1.Potential stress point 2.Foreign matter entrapment on pad 3.Possible worse dimensional tolerance on ... Hot Air Solder Leveled (HASL), electroless or electrolytic nickel/gold (NiAu) and immersion silver (Ag)

  Joint, Solder

ELECTRONICS INDUSTRIES Performance Test Methods and ...

the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it pro-vides an approximate means of relating the results from these performance tests to the reliability of solder attach-ments for the use environments and conditions of elec-tronic assemblies.

  Solder

Requirements and Acceptance for Cable If a conflict occurs ...

IPC/WHMA-A-620D Requirements and Acceptance for Cable and Wire Harness Assemblies Developed by the IPC Task Group (7-31f) of the Product Assurance Subcommittee (7-30) …

  Requirements, Cable, Acceptance, Requirements and acceptance for cable