Transcription of SOT23 - NXP
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SOT23 - NXP
SOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm body9 January 2017 Package information1. Package summaryDimensions (mm) x x 1 Terminal position codeD (double)Package type descriptive codeTO-236 ABPackage outline version codeSOT23 Manufacturer package codeSOT23 Package type industry codeTO-236 ABPackage outline version descriptionplastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodyPackage style descriptive codeSOT (small outline transistor)Package body material typePJEDEC package outline codeTO-236 ABHandling precautionsIC26_CHAPTER_3_2000 Thermal design considerationsSC18_1999_CHAPTER_5_2 Mounting method typeS (surface mount)Generic mounting and soldering informationAN10365_3 Reflow soldering footprintSOT023_frWave soldering footprintSOT023_fwPackage life cycle statusRELM ajor version date18-9-2008 Minor version date6-7
solder lands solder resist occupied area solder paste s ot0 23 _f r 0.5 (3×) 0.6 (3×) 0.6 (3×) 0.7 (3×) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm ... customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
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