ELECTRONICS INDUSTRIES Solderability Tests for Printed …
IPC J-STD-003BSolderabilityTests forPrinted BoardsDeveloped by the Printed Wiring board Solderability Specification TaskGroup (5-23a) of the Assembly & Joining Processes Committee (5-20)of IPCUsers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309SBannockburn, IL 60015-1249Phone ( 847) 615-7100Fax (847) 615-7105Supersedes:J-STD-003A - February 2003J-STD-003 - April 1992IPC-S-804A - January 1987IPC-S-803IPC-S-801ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of ........................................ ...................... ........................................ ................... ........................................ ................ or Should ........................................ ...... Hierarchy.
Solderability Tests for Printed Boards 1 GENERAL 1.1 Scope This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and
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