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ELECTRONICS INDUSTRIES Solderability Tests for Printed …

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IPC J-STD-003BSolderabilityTests forPrinted BoardsDeveloped by the Printed Wiring board Solderability Specification TaskGroup (5-23a) of the Assembly & Joining Processes Committee (5-20)of IPCUsers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309SBannockburn, IL 60015-1249Phone ( 847) 615-7100Fax (847) 615-7105Supersedes:J-STD-003A - February 2003J-STD-003 - April 1992IPC-S-804A - January 1987IPC-S-803IPC-S-801ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of ........................................ ...................... ........................................ ................... ........................................ ................ or Should ........................................ ...... Hierarchy.

Solderability Tests for Printed Boards 1 GENERAL 1.1 Scope This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and

  General, Tests, Printed, Board, Solderability, Solderability tests for printed boards, Solderability tests for printed

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