Transcription of ELECTRONICS INDUSTRIES Solderability Tests for Printed …
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ELECTRONICS INDUSTRIES Solderability Tests for Printed …
IPC J-STD-003 BSolderabilityTests forPrinted BoardsDeveloped by the Printed Wiring board Solderability Specification TaskGroup (5-23a) of the Assembly & Joining Processes Committee (5-20)of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, IL 60015-1249 Phone ( 847) 615-7100 Fax (847) 615-7105 Supersedes:J-STD-003A - February 2003J-STD-003 - April 1992 IPC-S-804A - January 1987 IPC-S-803 IPC-S-801 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. or Should .. Hierarchy .. Classes .. Classification .. Acceptance Criteria Tests .. Measurement Criteria Tests .. (s) Methodologies Under CommitteeReview .. Method Selection .. Specimen Requirements .. Durability .. 32 APPLICABLE.
Solderability Tests for Printed Boards 1 GENERAL 1.1 Scope This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and
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