Flex Crack Mitigation - KEMET
As part of continuous process improvement at KEMET ,most failure modes caused by the capacitor manufacturingprocess have been systematically eliminated. Today thesecapacitor manufacturing-related defects are now at a parts-per-billion (PPB) level. Pareto analysis of customer com-plaints indicates that the #1 failure mode is IR failure due toflex CracksFlex cracks have been known in PCB manufacturing forquite some time. flex cracks are created in capacitorswhen board flex stress / bending stress is applied to a circuitboard with ceramic components already affixed to the the ceramic capacitor is inherently hard, non-elastic, andbrittle (relative to the PCB), any bending of the board cre-ates stress, and that stress can b
PCB assembly continues to evolve, and by carefully understanding and controlling the board assembly process, the occurrence of board flex stress can be reduced.
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