IPC-TM-650 TEST METHODS MANUAL
1 ScopeThis test method is to characterize fluxes bydetermining the degradation of electrical insulation resistanceof rigid printed wiring board specimens after exposure to thespecified flux . This test is carried out at high humidity and Applicable DocumentsIPC-B-24Surface Insulation Resistance Test BoardIPC-A-600Acceptability of Printed BoardsIPC J-STD-004Requirements for Soldering FluxesIPC-9201Surface Insulation Resistance Handbook3 Test SpecimenA minimum of 10 ml of liquid flux , a rep-resentative container of solder paste, cored wire, paste flux , orextracted solder preform flux . The reflow/extraction processshould be carried out in accordance with IPC Comb PatternsUse the IPC-B-24 test pattern (seeFigure 1), which consists of four comb patterns per individual comb has mm lines and mm metallization shall be unpreserved bare LaminatThe laminate material for this test shall beFR-4 clean test chamber capable of programming andrecording an environment of 25 +10/-2 C [77 + 18/-3 F] toat least 85 2 C [185 F] and 20% 5% to 85% 2%relative humidity.
1 Scope This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux.
Download IPC-TM-650 TEST METHODS MANUAL
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: