Layout Design Guide - Toradex

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Layout Design Guide Layout Design Guide Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l l Page | 2 Issued by: Toradex Document Type: Design Guide Purpose: This document is a guideline for designing a carrier board with high speed signals that is used with Toradex Computer Modules. Document Version: Revision History Date Version Remarks 14 April 2015 Initial Release, based on section 2 of the Apalis Carrier Board Design Guide Layout Design Guide Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l l Page | 3 1 Introduction ........................................ ........................................ ....................................... 4 Overview.

TIM Thermal Interface Material - thermal conductive material between CPU and heat spreader or heat sink TMDS Transition-Minimized Differential Signaling - serial high speed transmitting technology that is used by DVI and HDMI TVS Diode Transient-Voltage-Suppression Diode - diode that is used to protect interfaces against voltage spikes UART

  Layout, Spreader