Plastic Package Reliability - Computer Action Team

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C. Glenn ShirleyPlastic Package ReliabilityC. Glenn ShirleyIntegrated Circuits Design and Test LaboratoryElectrical and Computer EngineeringPortland State UniversityPortland, ~cgshirl/ C. Glenn ShirleyOutline Plastic packages Stress and Test Flows Thermal Mechanisms Moisture Mechanisms Thermo-mechanical Mechanisms Moisture-mechanical Mechanisms Technology Update8/2-4/2011Plastic Package Reliability2 C. Glenn ShirleyPlastic-Encapsulated Microcircuits The course covers Plastic -encapsulated microcircuits. Molding compound (MC) in PEMs comes in direct contact with the die and chip Package Reliability3Epoxy Based Molding CompoundSolder Grid ArrayBT Resin Multilayer PCBMetal Heat Sink PlateAg -Epoxy AdhesiveSolder BallsExpoxy Based Molding CompoundAg -Epoxy AdhesiveTape/AdhesiveDielectricCopper Heat SlugSingle LayerLead Frame C.

© C. Glenn Shirley Plastic-Encapsulated Microcircuits •Die is mounted on a lead frame (A42 or Cu). •Bonds are made by. –Wirebond: Au or Al; mostly Au.

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