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Plastic Package Reliability - Computer Action Team

C. Glenn ShirleyPlastic Package ReliabilityC. Glenn ShirleyIntegrated Circuits Design and Test LaboratoryElectrical and Computer EngineeringPortland State UniversityPortland, ~cgshirl/ C. Glenn ShirleyOutline Plastic packages Stress and Test Flows Thermal Mechanisms Moisture Mechanisms Thermo-mechanical Mechanisms Moisture-mechanical Mechanisms Technology Update8/2-4/2011 Plastic Package Reliability2 C. Glenn ShirleyPlastic-Encapsulated Microcircuits The course covers Plastic -encapsulated microcircuits. Molding compound (MC) in PEMs comes in direct contact with the die and chip Package Reliability3 Epoxy Based Molding CompoundSolder Grid ArrayBT Resin Multilayer PCBM etal Heat Sink PlateAg -Epoxy AdhesiveSolder BallsExpoxy Based Molding CompoundAg -Epoxy AdhesiveTape/AdhesiveDielectricCopper Heat SlugSingle LayerLead Frame C.

© C. Glenn Shirley Plastic-Encapsulated Microcircuits •Die is mounted on a lead frame (A42 or Cu). •Bonds are made by. –Wirebond: Au or Al; mostly Au.

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