Free Reflow
Found 6 free book(s)Best Practices Reflow Profiling for Lead-Free SMT Assembly ...
kicthermal.comThis paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process. It also discusses trouble-shooting of the most common defects in lead-free reflow, such
AS5600 - ams.com
ams.comThe reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is “Matte Tin” (100% Sn) RHNC Relative humidity (non-condensing) 585 %
Handling, Packing, Shipping and Use of Moisture/Reflow ...
www.ipc.orgReflow and/or Process Sensitive Components 1 FOREWORD The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage ... By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal ...
MICROJ-SERIES - Silicon Photomultipliers (SiPM), High PDE ...
www.onsemi.coma chip-scale package that is compatible with lead-free, reflow soldering processes. The glass cover is ideal for coupling to scintillators or fibre optic elements. The dead-space between the sensor active area and the edge of the package has been minimized, resulting in a package that can be tiled on 4 sides with high fill-factor.
Chip beads for power line MPZ series - TDK
product.tdk.comRECOMMENDED REFLOW PROFILE PACKAGING STYLE REEL DIMENSIONS TAPE DIMENSIONS PACKAGE QUANTITY TEMPERATURE RANGE, INDIVIDUAL WEIGHT The storage temperature range is for after the assembly. Dimensions in mm Thickness(T) 0.6±0.15mm 0.8±0.15mm 0.8±0.15 1.6±0.15 0.3±0.2 T Dimensions in mm 0.6 0.8 0.6 0.8 Natural cooling 10s …
BAV70 series High-speed switching diodes
assets.nexperia.com1. Product profile 1.1 General description. High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1.