Cracks: The Hidden Defect - Advanced Electronic Components

with temperature changes or assembly flexure during handling. In a matter of weeks a micro crack can propa-gate through the ceramic causing opens, intermittents or excessive leakage currents, a time bomb due to processing (Figure 6). Figure 5. The Micro Crack Location Figure 6. A Propagated Micro Crack After Power Cycling

  Component, Temperatures, During, Cycling